Intel Corporation

Priyanka Dobriyal

Raiyomand F Aspandiar

Quan Anh Tran

Ankur Agrawal

Susheel G Jadhav

John Heck

Raghuram Narayan

Suriyakala Ramalingam

Kenneth Brown

Chester C Lee

Kenneth M Brown

Ankur Agarwal

Embodiments disclosed herein include electronic packages with vents to prevent pressure buildup below a die. In an embodiment, an electronic package comprises a package substrate and a die attached to the package substrate by interconnects. In an embodiment, an underfill is under the die and surrounds the interconnects. In an embodiment, a void is provided in the underfill, and a vent is in the underfill. In an embodiment, the vent is fluidically coupled to the void and extends to an edge of the underfill.

Photonic package laser area macro-void pressure relief micro-channels

Embodiments disclosed herein include optoelectronic systems and methods of forming such systems. In an embodiment the optoelectronic system comprises a board, and a carrier attached to the board. In an embodiment, a first die is on the carrier. In an embodiment, the first die is a photonics die, and a surface of the first die is covered by an optically transparent layer.

Silicon photonic integrated lens compatible with wafer processing

An integrated circuit assembly includes a support (e.g., package substrate or circuit board) and a semiconductor die including a device. The semiconductor die is mounted to the support with the device facing the support. The device can be, for example, a quantum well laser device or a photonics device. A layer of decoupling material is on the device. An underfill material is between the semiconductor die and the support, where the decoupling material is between the device and the underfill material. The decoupling layer decouples stress from transferring from the underfill material into the device. For example, the decoupling material forms only weak bonds with the underfill material and/or a passivation layer on the device, in an embodiment. Weak bonds include non-covalent bonds and non-ionic bonds, for example. The decoupling material can be, for instance, a PTFE film, a poly(p-xylylene) film, a fluorocarbon, or a compound lacking free hydroxyl groups.

Decoupling layer to reduce underfill stress in semiconductor devices

An electronic system includes a printed circuit board (PCB), a component affixed to the PCB, and a conformal coating layer on the PCB and the component. The conformal coating layer includes parylene. Furthermore, the electronic system includes an underfill layer adjacent to the conformal coating layer, filling a gap between the PCB and the component. Other embodiments being described and/or claimed.

Apparatus and method for conformal coating of integrated circuit packages

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Hillsboro, OR, United States of America

Priyanka Dobriyal