Rudolph Technologies, Inc.

University of Colorado

Onto Innovation Inc.

Priya Mukundhan

Manjusha Mehendale

Michael Kotelyanskii

Robin Mair

Todd William Murray

George Andrew Antonelli

Jacob D Dove

Guray Tas

Sean P Leary

Michael Colgan

Wei Zhou

James Francis Kane

Xueping Ru

Jonathan Cohen

Timothy Kryman

Dario Alliata

Jana Clerico

Zhongning Dai

Fei Shen

Steven Peterson

Jian Ding

Francis C Vozzo

An alignment or overlay target that has an optically opaque layer disposed between the top and bottom target structure is measured using opto-acoustic metrology. A classifier library is generated for classifying whether an opto-acoustic metrology signal is on or off the bottom structure. A target may be measured by acquiring opto-acoustic measurement data for the bottom structure of the target and determining a location of the bottom structure using opto-acoustic metrology data acquired from the different locations over the bottom structure and the classifier library. Locations for acquisition of the data may be based on classification results of each measurement and a search pattern. The top structure of the target may be optically imaged. The relative position of the top structure with respect to the bottom structure is determined using the opto-acoustically determined location of the bottom structure and the image of the top structure.

System and method for performing alignment and overlay measurement through an opaque layer

Systems and methods for inspecting or characterizing samples, such as by characterizing patterned features or structures of the sample. In an aspect, the technology relates to a method for characterizing a patterned structure of a sample. The method includes directing a pump beam to a first position on a surface of the sample to induce a surface acoustic wave in the sample and directing a probe beam to a second position on the sample, where the probe beam is affected by the surface acoustic wave when the probe beam reflects from the surface of the sample. The method also includes detecting the reflected probe beam, analyzing the detected reflected probe beam to identify a frequency mode in the reflected probe beam, and based on the identified frequency mode, determining at least one of a width or a pitch of a patterned feature in the sample.

Characterization of patterned structures using acoustic metrology

A method of cleaning calibration and other substrates that improves the correlation of measurements from calibration and product substrates and increases the useful life of the calibration substrates is herein disclosed. By exposing a calibration substrate to ultraviolet light, a reaction is triggered that results in the cleaning of the contaminants from the calibration substrate. For instance, monatomic oxygen is introduced to contaminants on the surface of a calibration substrate to remove the contaminants without inducing modifications in the substrate itself. Through the cleaning process, the temperature of the calibration substrate may be controlled to limit adverse effects caused by the overheating of the calibration substrate.

Calibration of semiconductor metrology systems

Advanced interconnect technologies such as Through Silicon Vias (TSVs) have become an integral part of 3-D integration. Methods and systems and provided for laser-based acoustic techniques in which a short laser pulse generates broadband acoustic waves that propagate in the TSV structure. An optical interferometer detects the surface displacement caused by the acoustic waves reflecting within the structure as well as other acoustic waves traveling near the surface that has information about the structure dimensions and irregularities, such as voids. Features of voids, such as their location, are also identified based on the characteristics of the acoustic wave as it propagates through the via. Measurements typically take few seconds per site and can be easily adopted for in-line process monitoring.

Non-destructive acoustic metrology for void detection

A system and method for identifying one or more characteristics of a structure formed into a substrate is herein disclosed. Surface and bulk acoustic waves are induced in the substrate and travel past a structure of interest where the acoustic waves are sensed. Information concerning one or more characteristics of the structure is encoded in the wave. The encoded information is assessed to determine the characteristic of interest.

Optical acoustic substrate assessment system and method

An automatically adjustable method for use in opto-acoustic metrology or other types of metrology operations is described. The method includes modifying the operation of a metrology system that uses a PSD style sensor arrangement. The method may be used to quickly adjust the operation of a metrology system to ensure that the data obtained therefrom are of the desired quality. Further, the method is useful in searching for and optimizing data that is or can be correlated to substrate or sample features or characteristics that of interest. Apparatus and computer readable media are also described.

Position sensitive detection optimization

A method for evaluating a manufacturing process is described. The method includes generating an optical pump beam pulse and directing the optical pump beam pulse to a surface of a sample. A probe pulse is generated and directed the probe pulse to the surface of the sample. A probe pulse response signal is detected. A change in the probe pulse varying in response to the acoustic signal forms the probe pulse response signal. An evaluation of one or more manufacturing process steps used to create the sample is made based upon the probe pulse response signal. Additionally the method may be used for process control of a CMP process. Apparatus are also described.

Characterization with picosecond ultrasonics of metal portions of samples potentially subject to erosion

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Lake Hopatcong, NJ, United States of America

Priya Mukundhan