Intel Corporation

Pritulkumar Shah

Frank R Deweese

Michael Likov

A package assembly includes a device package having a package perimeter footprint. A package riser is coupled with the device package. The package riser includes a riser body having a riser perimeter footprint corresponding to the package perimeter footprint. The riser body includes a package face coupled with the device package and an opposed platform face. A riser flange is proximate to the package face. The riser flange extends from the riser body. A package clamp is coupled with the device package and the package riser. The package clamp includes a clamp face coupled with the device package, and one or more clamp legs clamped to the riser flange. The device package is clamped between the clamp face and the package face.

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Redmond, WA, United States of America

Pritulkumar Shah