Alpha Assembly Solutions Inc.

Pritha Choudhury

Siuli Sarkar

Bawa Singh

Ranjit Pandher

Morgana De Avila Ribas

Sutapa Mukherjee

Ravindra Mohan Bhatkal

Anil Kv Kumar

Ravi Bhatkal

Nicholas G Herrick

Amit Patel

Suresh Telu

Anil K N Kumar

Anilkumar KN

Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.

Advanced solder alloys for electronic interconnects

A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.

Lead-free and antimony-free tin solder reliable at high temperatures

Lead-free solder alloys are described that exhibit favorable high temperature mechanical reliability and thermal fatigue resistance, and are typically capable of withstanding operational temperatures of at least 150&#xb0; C., for example up to 175&#xb0; C. The alloys may exhibit improved high temperature mechanical properties compared to the conventional Sn&#x2014;Ag&#x2014;Cu and Pb5Sn2.5Ag. The solder may be in the form of a bar, a stick, a solid or flux cored wire, a foil or strip, a film, a preform, or a powder or paste (i.e., a powder plus flux blend), or solder spheres for use in ball grid array joints or chip scale packages, or other pre-formed solder pieces, or a reflowed or solidified solder joint, or pre-applied on any solderabie material such as a copper ribbon.

High reliability lead-free solder alloy

A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.

Low temperature high reliability alloy for solder hierarchy

Growing community of inventors

Bengaluru, India

Pritha Choudhury