Evonik Operations Gmbh

Air Products and Chemicals, Inc.

Evonik Degussa Gmbh

Pritesh G Patel

Gauri Sankar Lal

Gamini Ananda Vedage

Stephen Michael Boyce

Edze Jan Tijsma

Dilipkumar Nandlal Shah

Douglas M La Comare

Kristen Elaine Minnich

Atteye Houssein Abdourazak

Shiying Zheng

Jared Denis Bender

Garret C Lau

Jamie Schneck

Joseph DiBiase

Judith Dolores Espinoza Perez

Peter Lucas

Sebastian De Nardo

Steffen Kanzler

Gauri Sankar Lai

The present invention relates to an epoxy resin system containing the reaction product of an epoxy resin component and an amine-based curing agent component comprising a first amine component and a second amine component, and a method for producing the epoxy resin system comprising combining an epoxy resin component with an amine-based curing agent component to form an initial epoxy resin composition, the amine-based curing agent component comprising a first amine component and a second amine component; and allowing a chemical reaction to occur between the amine-based curing agent component and the epoxy resin component to form a cured epoxy resin composition. The first amine component is N-(3-aminopropyl) cyclohexylamine and the second amine component is the hydrogenated product of oligomeric structure from the 4,4'-Methylenedianiline process.

Cycloaliphatic amines for epoxy formulations: a novel curing agent for epoxy systems

The present invention relates to an epoxy resin system containing an epoxy resin and a mono-alkylated diamine. The epoxy resin system can further contain a second amine. The present invention also relates to a method for producing an epoxy resin system comprising combining an epoxy resin with a mono-alkylated diamine. The mono-alkylated diamines of this invention enhance desirable processing and cured properties of epoxy resin compositions without the negative impact on mechanical properties in the cured product normally seen with cycloaliphatic amine-based curing agents.

Mono-alkylated diamines for epoxy formulations: novel curing agents for epoxy systems

The present invention relates to a PVC plastisol composition comprising at least one vinyl chloride polymer selected from polyvinylchlorides and copolymers of vinyl chloride with one or more monomers; at least one plasticizer; at least one epoxy resin; and at least one isocyanate resin blocked with cardanol. The PVC plastisol composition of this invention provides strong adhesion to the surface of various metals or various undercoats of metals by thermal treatment for a short time at 100&#xb0; C.-200&#xb0; C. and is excellent in storage stability. In addition, it offers good rheological properties with improved yield value dosing and viscosity stability during applications compared to the nonylphenol blocked isocyanate PVC adhesion promotor.

Cardanol blocked isocyanate adhesion promotor for PVC plastisol

A curing agent composition comprising anhydride and approximately equimolar amount of tertiary amine or imidazole and carboxylic acid, the amine being 1-piperidinylethanol (N-hydroxyethyl-piperidine, NHEP) represented by the structure below or an imidazole represented by the structure below: where R=H, a C1-C20 straight chain or branched alkyl, or a monocyclic aryl; R=a C1-C20 straight chain or branched alkyl, or a monocyclic aryl. The carboxylic acid is represented by RCOOH; R=a C1-C20 straight chain or branched alkyl, or a monocyclic aryl. The composition comprises a lower ratio of epoxy resin to anhydride (1:0.4-0.6) than typically used (1:0.8-1.1). In addition, it uses a higher loading of the hindered latent tertiary amine or the imidazole in combination with the carboxylic acid (wt % ratio of combined amine and carboxylic acid to anhydride &#x2dc;10%). With this composition a full cure can be achieved in less than 2 hr at a significantly lower temperature (&#x2dc;100&#xb0; C.).

Low temperature anhydride epoxy cured systems

The present invention relates to an amine-based curing agent comprising at least 1% by weight of at least one tertiary amine and, optionally, primary and/or secondary amines. The tertiary amine is preferably an N-substituted piperidine tertiary amine and, more preferably, N-hydroxyethyl piperidine (NHEP). The present invention also relates to an epoxy resin composition formed using this amine-based curing agent and a method of making the epoxy resin composition. These tertiary amines enhance desirable properties of epoxy resin compositions without the negative impact on mechanical properties in the cured product normally seen with tertiary amine-based curing agents.

N-hydroxyl ethyl piperidine (NHEP): a novel curing agent for epoxy systems

The disclosure relates to at least one partially reacted product of an isocyanate and an amine (e.g., a reaction product comprising at least one adducted compound). The reaction product comprises polyurea oligomers. The reaction product can be combined with at least one amine in order to formulate a curing agent for epoxy resins wherein the cured epoxy resin has enhanced fracture toughness. The at least partially reacted product does not increase the viscosity of the curing agent and is at least partially soluble in the amine component of the curing agent.

Epoxy systems having improved fracture toughness

An epoxide based composition that can be cured at a temperature of less than about 70 C is disclosed. The composition is a liquid at ambient conditions and, therefore, can be used to rehabilitate the interior surfaces of pipelines. The epoxide-based composition comprises at least one epoxide component (component A) and at least one curing agent component (component B) wherein

Epoxide-based composition

The present disclosure provides a liquid curing agent composition comprising at least 50% by weight of a polyamine and 0.2% to 10% by weight of dicyandiamide, the amine/epoxy composition and the product from the cured amine/epoxy composition.

Epoxy liquid curing agent compositions

A liquid methylenedianiline product is disclosed. The product is produced by reacting aniline and ethylaniline with formaldehyde with an amine to formaldehyde ratio greater than about 2:1. The resulting reaction product is a liquid mixture of methylenedianiline, monoethyl methylenedianiline, and diethyl methylenedianiline having a viscosity of less than about 1000 cps at 40&#xb0; C.

Liquid methylenedianiline compositions

An epoxy resin composition having a curing component and an epoxy component is disclosed. The curing component includes an amount of about 8% to about 70% by weight of the composition of a primary curing agent and about 0.001% to about 5% by weight of the composition of a secondary curing agent. The present disclosure includes the use of solid secondary curing agents, in particular solvated secondary curing agents, and methods to formulate such a solvated solid to result in a liquid curing component. The epoxy composition also includes about 30% to about 92% by weight of the composition of the epoxy component. A number of equivalents of reactive curative groups in the curing component is from about 0.50 to 0.98 times the number of epoxide equivalents present in the epoxy component. An epoxy product formed from the epoxy resin composition is also disclosed.

Epoxy resin compositions using solvated solids

Carboxylic acid salts of tertiary amines for use as an accelerator for an anhydride based epoxy curing agents are disclosed. The disclosed carboxylic acid salts of certain tertiary amines are latent anhydride accelerators and enable epoxy resin curing when heated to an elevated temperature (e.g., an onset temperature of greater than about 50&#xb0; C.).

Growing community of inventors

Breinigsville, PA, United States of America

Pritesh G Patel