Avago Technologies General IP (singapore) Pte. Ltd.

Asm Technology Singapore Pte Ltd

Premkumar Jeromerajan

Tay Thiam Siew Gary

Srikanth Narasimalu

Gopinath Maasi

Thiam Siew Tay

A semiconductor device and methods of manufacturing the same are disclosed. Specifically, methods and devices for manufacturing opto-couplers are disclosed. Even more specifically, the opto-coupler includes a lens assembly to enhance light coupling efficiency between an optical transmitter and an optical receiver. An encapsulant material may also be utilized.

Opto-coupler and method of manufacturing the same

An optocoupler having optical lens layer is disclosed. The optocoupler may comprise an optical emitter, an optical receiver, an isolation layer, a lens layer and a substantially transparent encapsulant. The lens layer may be integrally formed within the optical receiver. Alternatively, the lens layer may be formed integrally with the isolation layer, or the lens layer may be an optical film attached on the optical receiver. The substantially transparent encapsulant may encapsulate at least partially the optical emitter, the optical receiver and the isolation layer. The isolation layer may be inserted to the substantially transparent encapsulant, making the substantially transparent encapsulant into two compartments. In another embodiment, an electronic system having optocoupler is disclosed.

Optocoupler having lens layer

A semiconductor device and methods of manufacturing the same are disclosed. Specifically, methods and devices for manufacturing optocouplers are disclosed. Even more specifically, methods and devices that deposit one or more encapsulant materials on optocouplers are disclosed. The encapsulant material may include silicone and the devices used to deposit the silicone may be configured to simultaneously deposit the silicone on different sides of the optocoupler, thereby reducing manufacturing steps and time.

Simultaneous silicone dispension on coupler

A method is provided for removing excess encapsulation material from unmolded surfaces of a molded substrate including semiconductor packages by utilizing an acid solution. The method comprises the steps of mounting the substrate to a holding device with the unmolded surfaces facing an acid source for supplying an acid solution, contacting the unmolded surfaces with the acid solution for a sufficient time to remove the excess encapsulation material from the unmolded surfaces while substantially avoiding contact with molded surfaces thereof, and thereafter removing the substrate from contact with the acid solution.

Growing community of inventors

Singapore, Singapore

Premkumar Jeromerajan