Intel Corporation

Prateek J Dujari

Bin Lian

Damion T Searls

Terrance J Dishongh

Franklin G Monzon

Pooya Tadayon

Terry Dishongh

Terrence J Dishongh

A circuit board includes two planes. A via spans the planes, and an impedance component is placed in the via. The impedance component is coupled to both of the planes. The impedance component provides an impedance between the planes without the use of traces or hand soldering of components.

Circuit board with added impedance

A semiconductor substrate with integrated circuit devices on its front side and a high thermal conductivity layer such as diamond on its back side, with components such as capacitors embedded in the high thermal conductivity layer and coupled to the front side integrated circuits with vias through the substrate.

Semiconductor device with components embedded in backside diamond layer

An electrical energy-generating heat sink system is described herein that provides a convenient and economical method for continuously recharging an energy storage device in electronic devices.

Electrical energy-generating heat sink system and method of using same to recharge an energy storage device

A metallurgical process expands the grain structure in a heat sink from a fine grain to a coarse grain to improve the thermal conductivity of the heat sink. The temperature of the heat sink is raised to a level high enough to lead to a secondary re-crystallization grain growth in the metal alloy. The temperature of the heat sink is then gradually lowered to a cryogenic temperature and then immediately brought back up to ambient temperature to strengthen the material.

Metallurgically enhanced heat sink

An enhanced joint thickness lead used for surface mounting electronic devices to a substrate, wherein a portion of the enhanced joint thickness lead that is substantially parallel to the substance. The enhanced joint thickness lead includes an arcuate structure, which provides an enhanced joint thickness for the solder used to connect the lead to the substrate. The enhanced joint thickness of the solder results in a more robust attachment of the electronic device.

Surface mount connector lead

An iodine-containing thermal interface material disposed between a heat source and a heat dissipation device.

Iodine-containing thermal interface material

A device and method for increasing input/output from a die by making electrically conductive microvias connecting the integrated circuit with a backside of the die. The backside electrically conductive microvias connect an integrated circuit in the die to pads on the backside of the die. A superstrate is situated on top of the die and connects to the microvias using controlled collapse chip connections (C4) with a thermal interface material (TIM) surrounding the electrical connections. A superstrate lead system electrically connects the backside pads to wirebonds that connect with either the substrate or directly to the motherboard. Heat dissipates from the die via the TIM to the superstrate to a heat sink situated on top of the superstate.

Chip package enabling increased input/output density

Photon emissions from a backside of a silicon device or integrated circuit are detected. The photon emissions can be used for a technique to read output information from the silicon device, as the photon emissions from part of an output signal path for the silicon device. The emitted photons pass through openings of a mask positioned over the backside of the silicon device, and are detected by a photodetector array. Electrical signals are generated from the detected photons, and can be converted to optical signals for subsequent transmission from optical transmitters coupled to the photodetector.

Apparatus and method to read output information from a backside of a silicon device

A heat dissipation device including a base portion having a plurality of projections extending therefrom. The base portion may have a vapor chamber defined therein and may have first surface sloped from a central apex portion to edges of the base portion. The vapor chamber includes at least one extension on a vapor chamber upper surface which is adapted to direct a condensed working fluid toward a desired location on a vapor chamber lower surface. The vapor chamber lower surface may have at least one depression to collect a greater portion of the working fluid in a desired location(s).

Vapor chamber active heat sink

A method and apparatus comprising using buried microchannels to cool specific areas of a substrate over which high heat generating elements of integrated circuits, circuits or devices are processed is disclosed. In one embodiment of the method and apparatus comprise running a cooling fluid thorough a buried microchannel under a heat generating element to locally cool the substrate.

Process for local on-chip cooling of semiconductor devices using buried microchannels

Piezoelectric wafers are affixed to a circuit card to control displacement of the circuit card when vibrated. A trigger wafer located at an anti-node of the dominant mode shape produces a voltage as a function of modal displacement. A control system responsive to the trigger wafer produces voltages that are applied to flex wafers at a different anti-node of the dominant mode shape. The flex wafers expand and contract in a manner that reduces the modal displacement of the circuit card. Multiple flex wafers can exist, affixed to the circuit card substantially opposite each other, or a single flex wafer can exist with a single trigger wafer. The trigger wafer can be located substantially opposite the flex wafer or can be located elsewhere on the circuit card.

Circuit card assembly having controlled vibrational properties

Piezoelectric material is embedded in epoxy layers of circuit cards to control thermal expansion and contraction as a function of temperature changes. A temperature sensor and thermostat generates a controlled voltage as a function of temperature and applies the voltage to piezoelectric blocks within the circuit card. Local areas of the circuit card can have different amounts of piezoelectric material or different thermostats. Piezoelectric blocks can be arranged in regular patterns or can be randomly or pseudo-randomly placed.

Growing community of inventors

Portland, OR, United States of America

Prateek J Dujari