Shipley Company LLC

Prasit Sricharoenchaikit

Michael Gulla

Gary S Calabrese

A process for metal plating characterized by use of an accelerator solution of a metal reducible by stannous tin between a step of catalysis and metal deposition.

Metal accelerator

This invention describes methods for altering a substrate in a fine line image pattern using a microlithographic process including formation of a metal mask over a photoresist coating to protect the photoresist coating during dry development of the same. The invention also describes a method for formation of the metal mask. Briefly stated, the process of the invention comprises the steps of coating a substrate with a photoresist coating, exposing the photoresist coating so formed to a desired pattern of actinic radiation, catalyzing the entire surface of the photoresist coating with an electroless plating catalyst, developing the photoresist layer to a depth at least sufficient to remove the undesired catalyst layer in an image pattern, forming a metal pattern on the desired (remaining) catalyst layer and dry developing the remaining photoresist coating unprotected by the metal mask.

Plasma processing with metal mask integration

A composition for electrolessly depositing thin metal coatings in selective patterns of fine dimension. The electroless plating solutions of the invention are characterized by a low metal content and preferably, freedom from alkali or alkaline earth metal ions.

Controlled electroless plating

A process for selective metallization comprising the steps of providing a substrate coated with a photoresist, imaging the photoresist coating by exposure to pattern radiation and development, flood exposing the photoresist coating to activating radiation, depositing an electroless plating catalyst over the entire imaged photoresist coating and bared underlying substrate, removing the top surface of the flood exposed, catalyzed photoresist coating by development whereby plating catalyst remains in a desired selective pattern and depositing metal over the catalyzed surface to form a metal deposit in a selective pattern such as in a circuit pattern. The process is suitable for the manufacture of diverse articles including printed circuit boards.

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Millis, MA, United States of America

Prasit Sricharoenchaikit