Honeywell International Inc.

Prashantha Sv

Deepak Kumar

Prashant Deshpande

Pranita Madke

Sridhar Vanka

Ritu Rai

A device includes a processor or integrated circuit package and at least one MEMS device coupled to the processor or integrated circuit package. The at least one MEMS device includes a first arm, a second arm, at least one permanent magnet, a fan structure, and a coil. The second arm is coupled to, and is spaced apart from, the first arm. The at least one permanent magnet is coupled to the first arm. The fan structure is coupled to, and extends in cantilever manner from, the second arm. The coil is disposed on or within the fan. Thus, when the coil is electrically energized, a Lorentz force is generated that causes the fan structure to vibrate relative to the at least one permanent magnet and relative to the processor, to thereby cool the processor or integrated circuit package.

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Bengaluru, India

Prashantha Sv