Lsi Logic Corporation

Lsi Corporation

Other

Prashant K Singh

Donald C Grillo

Keith R Maile

Brett D Hardy

John J Stronczer

Todd M Tanji

Scott Redinger

Helga Foulk

Michael O Jenkins

Jeffrey S Kueng

An apparatus, system and method are described for impedance matching between a semiconductor package and a load on a board. In one embodiment of the present invention, a package trace is provided with an array of stubs that is designed to provide capacitance to the trace in order to more effectively match a wirebond. This improved match results in improvements in return loss, especially in higher speed applications such as broadband. Design parameters such as the width and length of each stub, and the spacing between the stubs may be varied depending on the impedance requirements of the trace.

Stub-tuned wirebond package

A method and system of frequency domain equalization. In an embodiment, the frequency domain equalizer system includes a transmit driver. A receiver decision circuit is communicatively coupled to the transmit driver. The receiver decision circuit may have an input signal and an output signal. An all-pass filter may be communicatively coupled to the transmit driver and the receiver decision circuit. The all-pass filter having an all-pass input signal which comprises an integration of a summation of the receiver decision circuit input signal and the receiver decision circuit output signal, each signal being acted upon by at least one band-pass filter.

Method and system of frequency domain equalization

A peripheral device includes a data port having high and low impedance terminations, a transmitter having a data signal generator and a receiver detector. The data signal generator is electrically coupled to the low impedance termination of the data port when in a low impedance operating mode, and to the high impedance termination when in a high impedance operating mode. The receiver detector includes a noise detector adapted to detect a presence or an absence of rail-to-rail noise at the data port when the transmitter is in the high impedance operating mode.

Peripheral device receiver detection in a high noise environment

A receiver detector of a peripheral device for use in a computer system to detect whether a receiver is electrically coupled to a data port of the peripheral device includes a modulator, a high pass filter, and a demodulator. The modulator is configured to modulate a receiver detect signal at a frequency that is higher than a noise frequency, below which high amplitude noise can develop. The high pass filter is electrically coupled to the receiver detect signal and is configured to block frequencies of the receiver detect signal that are below the noise frequency and pass a filtered receiver detect signal. The demodulator is configured to demodulate the filtered receiver detect signal and produce a recovered receiver detect signal that is indicative of whether a receiver is electrically coupled to the data port.

The present invention is an apparatus and system for reducing bondpad capacitance of an integrated circuit. Circuitry of the present invention may produce a negative capacitance approximately equal in magnitude to the capacitance associated with the bondpad and thereby effectively eliminate the bondpad capacitance. Values of the components of the circuitry may be selectively and independently chosen to synthesize a variable range of negative capacitance and thus produce a negative capacitance approximately equal in magnitude to a unique capacitance associated with the bondpad of a variety of integrated circuits.

Zero capacitance bondpad utilizing active negative capacitance

An inductor-capacitor voltage controlled oscillator is implemented using an active inductor. The active inductor may use bipolar technology or CMOS technology. The VCO with an active inductor offers a more compact design and is useable with flip chip technology. The active inductor may be implemented in bipolar junction or complementary metal oxide semiconductor technology. The configuration of the voltage controlled oscillator with an active inductor of the present invention is fully differential and fully symmetric.

Widely tuneable and fully differential LC oscillator utilizing an active inductor

The present invention is an apparatus and system for providing a high quality spiral inductor in an integrated circuit environment. A layer of inductor may be placed within the metal layers along with negative capacitance generation circuitry of the present invention to compensate for the capacitance associated with the metal layers adjacent to the inductor to provide a higher quality factor for the inductor. Advantageously, circuitry of the present invention may be employed within an integrated circuit without modifying the layer structure of the integrated circuit. Additionally, values of the components of the circuitry may be selectively and independently chosen to synthesize a variable range of negative capacitance.

High quality factor spiral inductor that utilizes active negative capacitance

A ring oscillator that uses active negative capacitance at one or more stages of the ring oscillator to adjust the frequency of oscillation. By using a negative capacitance generator, negative capacitance may be placed in shunt with each stage of the ring, thereby reducing the effective input capacitance. Tuning of the ring oscillation frequency is accomplished without changing the bias point of each stage. The ring oscillation frequency may be increased, rather than reduced as in current approaches.

Widely tunable ring oscillator utilizing active negative capacitance

Drive circuitry to provide a DC bias voltage and a high frequency modulation current to an electroabsorption modulator (EAM), including a high frequency modulation current source, a coupling capacitor, and a first DC lead. The drive circuitry may include termination circuitry. One lead of the high frequency modulation current source is electrically coupled to the first semiconductor type contact of the EAM and the other lead of the high frequency modulation current source is electrically coupled to an AC ground. The coupling capacitor includes a first electrode electrically coupled to the second semiconductor type contact of the EAM, a second electrode electrically coupled to the AC ground, and a dielectric layer between the electrodes. The first DC lead is electrically coupled to the EAM-side capacitor electrode and configured to be coupled to a first DC potential.

Device for coupling drive circuitry to electroabsorption modulator

An over-voltage protected integrated circuit is provided, which includes a discharge node, an input-output pad, a signal trace, which is coupled to the input-output pad, and a pair of back-to-back diodes, which is coupled between the first signal trace and the discharge node.

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Eden Praire, MN, United States of America

Prashant K Singh