Infineon Technologies Ag

Ericsson Gmbh

Telefonaktiebolaget Lm Ericsson (publ)

Infineon Technologies North America Corp.

Prasanth Perugupalli

Larry C Leighton

Nagaraj V Dixit

Thomas W Moller

Cynthia Blair

Gordon Ma

Bengt Ahl

Gordon C Ma

Gary Lopes

Tom Moller

Stan Lopuch

Nagaraj Vishwanath Dixit

An RF power circuit comprises a power transistor having a gate and drain, an output matching network coupled to the drain and an input matching network coupled to the gate. A closed-loop bias circuit is integrated with the power transistor on the same die and coupled to the gate for biasing the RF power transistor based on a reference voltage applied to the bias circuit.

Semiconductor power device with bias circuit

A semiconductor power device comprises a flange, a die having a gate, a source, and a drain. The source is electrically coupled to the flange. A drain matching circuit is located on the flange having an input, an output and a bias input, the input being coupled with the drain. The drain matching circuit comprises an inductor coupled in series with a first capacitor between the drain and flange and a second capacitor arranged next to the first capacitor, wherein the second capacitor is coupled with the bias input and in parallel with the first capacitor through a second inductor. An input terminal is mechanically coupled to the flange and electrically coupled with the gate, an output terminal is mechanically coupled to the flange and electrically coupled with the output of the drain matching circuit, and an input bias terminal is mechanically coupled to the flange and electrically coupled with the drain through the bias input.

Semiconductor power device and RF signal amplifier

A method for manufacturing a power transistor circuit includes securing a die to a substrate, the die comprising a transistor having an input terminal and an output terminal. One or more performance characteristics of the transistor are measured. Using one or more wire sets, the transistor input terminal is electrically connected to one or more input matching elements and an input signal lead. The impedance of the one or more wire sets, as determined by selecting a desired number and/or length of the wires in each set, is selected based at least in part on the measured transistor performance characteristic(s). Similarly, using one or more additional wire sets, the transistor output terminal is electrically connected to one or more output matching elements and an output signal lead, wherein the impedance of the additional wire sets is selected based at least in part on the measured transistor performance characteristic(s).

Bond wire tuning of RF power transistors and amplifiers

Conventional broadband RF power amplifiers use a &frac14; wavelength transmission line to decouple the gate bias DC source from the gate circuitry and a second &frac14; wavelength transmission line to decouple the drain bias DC source from the drain circuitry, taking up considerable printed circuit board space. A novel broadband RF power amplifier uses a transistor with separate terminals for injection of gate bias and drain bias DC sources, eliminating the need for &frac14; wavelength transmission lines, thereby freeing up space and allowing higher density packaging. The power amplifier transistor can be implemented with a single die circuit or multiple die circuits operating in parallel.

RF power transistor with internal bias feed

A broadband RF signal amplifier includes a plurality of transistors attached to a surface of a pedestal, each transistor having an input and an output. An RF input path electrically connected to the transistor inputs includes a passive splitter implemented in a multi-layer printed circuit board and configured to split a RF input signal into a plurality of component input signals. A plurality of corresponding input matching networks including one-quarter wavelength transmission lines implemented in the printed circuit board couple respective component input signals to the transistor inputs at an input impedance, the input matching networks further comprising respective input matching capacitors attached to the pedestal. An RF output path electrically connected to the transistor outputs includes a passive combiner implemented in the printed circuit board and configured to combine component output signals received at the transistor outputs into a RF output signal. A plurality of corresponding output matching networks including one-quarter wavelength transmission lines implemented in the printed circuit board couple the respective component output signals at the transistor outputs to an output impedance.

Multi-stage, high frequency, high power signal amplifier

A multistage power amplifier circuit with superior isolation between gain stages provides alternative common lead currents paths from the individual gain stage elements to obtain improved stability and operational performance.

Stability enhanced multistage power amplifier

Gain and bandwidth enhancement of a RF power amplifier package is effected by electrically coupling a power transistor to a RF signal source with an inductance, and further electrically coupling the input and common element terminals of the power transistor with a shunt inductance. The shunt inductance is chosen such that its reactance is the conjugate of the reactance of the power transistor's common-input capacitance. A similar conjugate matching output circuit is provided to electrically couple the transistor's output and common element terminals to a load. The shunt inductors are implemented on the package substrate by connecting the respective input and output transistor terminals to grounded shunt caps via bond wires.

Gain and bandwidth enhancement for RF power amplifier package

A push-pull transistor chip comprises a single/semiconductor die having first and second LDMOS transistors formed thereon and configured for push-pull operation, the first and second transistors sharing a common element current region. In a power transistor package, the push-pull transistor chip is attached to a mounting flange serving as a common element ground reference, wherein a conductor (e.g., one or more bond wires) electrically connects the shared common element current region to the mounting flange.

Single chip push-pull power transistor device

A power transistor according to one embodiment of the invention includes a plurality of transistor elements located on a single semiconductor die, each transistor element comprising one or more transistors coupled to a common gate terminal for the respective transistor element. A resistor network couples the transistor element gate terminals between a bias voltage and a reference ground, with resistors in the network sized such that such that a first transistor element is biased in a first, e.g., class A, operating condition, and a second transistor element is biased in a second, e.g., class AB operating condition.

Growing community of inventors

Tempe, AZ, United States of America

Prasanth Perugupalli