Sensata Technologies, Inc.

Prasanth Ambady

Andrew F Willner

Giovanni Fraone

Mark W McBrine

Lauren Snedeker

Yu Wang

Shihong Huo

Eric A Wolf

Daniel Goncalves

Ernie Schoot Uiterkamp

Louis Tomasso

Brian Wilkie

Gifford Plume

Calvin S Reuter

A pressure sensor apparatus for strain gauge pressure sensing includes a plurality of strain gauges including a first strain gauge and a second strain gauge. The pressure sensor apparatus also includes a diaphragm coupled between the plurality of strain gauges and an object configured to apply pressure to the diaphragm. The diaphragm has a first portion and a second portion. The first portion has a first thickness between the object and the first strain gauge. The second portion has a second thickness between the object and the second strain gauge. In an uncompressed state, the second thickness is greater than the first thickness.

Strain gauge type pressure sensing

In an embodiment, a pressure sensor includes a tip secured to a port. The tip includes an opening for receiving pressure to be measured by the pressure sensor. The port includes a threaded section for mounting the pressure sensor in a fixture such as, for example, a rail. The port also includes a flexible section, a cavity, and an opening. The opening in the tip receives pressure from an outside source and channels the pressure to the opening of the port. The opening of the port receives the pressure from the tip and channels the pressure to the cavity. The pressure received in the cavity applies a force to the flexible section which flexes in response to the force. Moreover, forces are provided by the tip and the threaded section to keep the tip secured to the port.

Pressure sensor comprising a tip secured to a port

A pressure sensor includes a sense element port, a support ring and a plurality of interference fit slits to provide a flexible interference fit between the sense element port and the support ring to form a substantially flush lap joint. The sensor also includes an electronics board inside the support ring and attached to planar mounting tabs which provide a stable mounting. Gel flow barriers protect electronics board features from unwanted non-conductive gel. Double-ended symmetrical, tapered contact springs provide manufacturing cost savings and contribute to improved alignment of an interface connector of the sensor.

Pressure sensor

A sliderthat integrates adaptor alignment and anti-stick features is shown for use in a socket for mounting BGA type IC devices for burn-in tests. Sliderhas a top wall surfaceformed with a plurality of apertures in a grid array defined by intersecting ribs. A plurality of wall extension portionsare formed extending upwardly from portions of x-direction ribs that serve as fine alignment features with an IC deviceadapted to be placed on the flat top end surface of the wall extension portions between rows of IC device solder ball terminals. Anti-stick fingersextend in the x-direction from wall extension portionsalong a y-direction rib defining the outer limit of the first columnof apertures of the main grid. A concave surfaceis formed in each finger facing wall portionsand the height of wall portionsis limited to a location below the position of solder balls of an IC device mounted in the socket to provide clearance for a mechanical support ball positioned in the first column of apertures next to wall extension portionoutside the main grid field to provide full grid array capability.

Burn-in sockets for BGA IC devices having an integrated slider with full ball grid compatibility

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Providence, RI, United States of America

Prasanth Ambady