Intel Corporation

Prasanna Pichumani

Prakash Kurma Raju

Bijendra Singh

Jayprakash Thakur

Raghavendra Doddi

Kathiravan D

Maruti Tamrakar

Gokul V Subramaniam

Sagar Gupta

Gopinath Kandasamy

Babu Triplicane Gopikrishnan

Arvind Sundaram

David Pidwerbecki

Juha Paavola

Harish Jagadish

Ritu Bawa

Shankara Venkatraman Gopalan

Rajeev Rema Shanmugam

Akarsha Rajeshwar Kadadevaramath

Aleksander Magi

Harry G Skinner

Jeff Ku

Naoki Matsumura

Mark Charles Carbone

Vivek Paranjape

Daniel J Ragland

Gavin Sung

Gustavo Fricke

Soethiha Soe

Samarth Alva

Arnab Sen

Hua Yang

Justin Michael Huttula

Ayeshwarya B Mahajan

Marko Bartscherer

Praveen Kumar

Kannan G Raja

Lance Lin

Jason Y Jiang

Jagadish Vasudeva Singh

Xiyong Tian

Baomin Liu

Twan Sing Loo

Columbia Mishra

Sachin Bedare

Ruander Cardenas

Jia Yan Go

Santhosh Ap

Hari Shanker Thakur

Bala P Subramanya

Christopher M Moore

Evan Piotr Kuklinski

Gerry Juan

Vamshi Krishna Aagiru

Yagnesh Vinodrai Waghela

Chin Kung Goh

Triplicane Gopikrishnan Babu

Vinay Kumar Chandrasekhara

Doddi Raghavendra

Raghavendra S Kanivihalli

Khal Ern See

Sammi Wy Liu

Nehakausar Pinjari

Mikko Makinen

Sudheera Sudhakar

Madhurkiran Sreenivasa Reddy

Bhavaneeswaran Anbalagan

Srinivas Rao Konakalla

Nithesha Ananda

Javed Shaikh

Zaman Zaid Mulla

Chun-Ting Liu

Shih Wei Nien

George Baoci Sun

A communication device including a chassis; and a wireless communication interface arranged at least in part on a mounting structure, wherein the chassis houses the wireless communication interface, wherein the wireless communication interface comprises an antenna; and wherein the chassis comprises a recess, and wherein the mounting structure is rotatably arranged in the recess.

Communication device

Disclosed herein is an encapsulated antenna for reducing the impact of radio frequency interference (RFI) that may couple to the antenna at frequencies within the Wi-FI 5/6e bandwidths. The encapsulated antenna device may include an insulating housing and a metal layer arranged within a cavity of the housing. The encapsulated antenna device also includes an antenna device comprising a ground terminal and an antenna body, wherein the ground terminal is connected to the metal layer, wherein the antenna body is arranged above the metal layer and within the cavity. The encapsulated antenna device also includes a spacer between the metal layer and the antenna body that provides an offset distance between the metal layer and the antenna body.

Encapsulated wireless antenna for reducing the impact of radio frequency interference

Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a keyboard, and a chassis, where a portion of the chassis is between the substrate and the keyboard. A transmission line is embedded in the portion of the chassis between the substrate and the keyboard. In some examples, the portion of the chassis between the substrate and the keyboard that includes the transmission line is a support plate for the keyboard.

Transmission line embedded in a portion of a chassis of an electronic device

Techniques for video conferencing are disclosed. In one embodiment, a mirror assembly can be used to position a mirror in front of a camera, reflecting a view of the camera downward towards a whiteboard or other drawing surface, allowing a user to show a drawing during a video conference. In another embodiment, video data and audio data of a user in a video conference can be analyzed to determine what portions of the video data and audio data should be transmitted to a remote participant in the video conference. Unintentional input supplied by the user in the video data and audio data may be used to determine which portions of the video data and audio data to transmit.

Technologies for video conferencing

An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices

Techniques for battery retention are disclosed. In the illustrative embodiment, a thin polyurethane strap is used to hold a battery in place. The strap only requires a small amount of volume, allowing for a higher volume (and higher capacity) for the battery. In order to accommodate swelling, a computing device that has a battery held in place with such a strap can have an open area above the battery. The strap may have ridges to contact the battery and the component above the battery beyond the open area. If the battery swells, the ridges may be pressed down, accommodating the swelling battery.

Technologies for battery retention

Various embodiments utilize part of an existing antenna pattern in a computing device to implement a specific absorption rate (SAR) sensor element using a radio frequency (RF) filter circuit. The integrated solutions of the present disclosure help to eliminate the external SAR sensor pad requirement and further help to improve wireless performance. The embodiments of the present disclosure may be implemented with a variety of different types of antenna (e.g., slot, metal ring/aperture, PCB, etc.). Other embodiments may be described and claimed.

Techniques for specific absorption rate (SAR) sensing elements in SAR circuits

An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.

Hinge assembly and guide assembly for electronic devices using a heat carrying member

Examples relate to concepts for antenna arrangement and particular to an antenna for an electronic device. An electronic device comprises, a case, a lid and a heat spreading structure. Further, an electronic device comprises a hinge arrangement between the case and the lid. The hinge arrangement comprises at least one hinge structure connecting the lid to the case. Further, the electronic device comprises an antenna. The antenna is arranged in an area of the hinge arrangement. The heat spreading structure extends from the case through the area of the hinge arrangement to the lid.

Antenna for an electronic device, an electronic device, a mobile device, a hinge structure, and a method for selecting an antenna

A slot antenna assembly for a portable electronic device is disclosed. The assembly includes a first slot antenna having a first slot through a substrate from an outer surface of the substrate to an inner surface of the substrate. The assembly also includes a second slot antenna including a second slot through the substrate from the outer surface of the substrate to the inner surface of the substrate. An isolator includes at least one of an isolation slot and a conductor. The isolation slot includes a substrate isolation slot which extends through the substrate between the first and second slot antennas; and a conductor. The conductor connects the inner surface of the substrate between the first and second antennas to an opposite inner surface of an opposite substrate opposite the inner surface between the first and second antennas.

Integrated combo slot antennas in full metal chassis and isolation improvement technique

Particular embodiments described herein provide for an electronic device that can be configured to include a fan where the fan blades are decoupled from the center shaft. The fan can include a center shaft, a motor coil support, motor coils coupled to the motor coil support, a rotator coupled to the center shaft, and fan blades coupled to the rotator, where rotation of the fan blades is decoupled from the center shaft by the rotator. A blade support can be coupled to the rotator, where the blade support couples the fan blades to the rotator and magnets can be coupled to the blade support. In an example, the rotator can include an inner, an outer race, and bearings.

Fan support

There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.

Thermal dissipation in dual-chassis devices

Particular embodiments described herein provide for an electronic device that can include a key height activation engine and a keyboard. The keyboard can include a plurality of keys and one or more of the plurality of keys can include a key height mechanism. The key height mechanism includes a shape memory material and when the key height mechanism is activated by the key height activation engine, the shape memory material raises the one or more of the plurality of keys that includes the key height mechanism from a first height to a second height.

Keyboard that includes shape memory material

A variable pitch clamshell hinge for use with clamshell housings includes a first shaft coupled to a first variable diameter device and a second shaft coupled to a second variable diameter device. The first variable diameter device and the second variable diameter device are coupled together using an inelastic linking element. As the shafts are rotated in a first direction the variable diameter devices increase in diameter. As the shafts are rotated in a second direction that is opposite the first direction, the variable diameter devices decrease in diameter. As the variable diameter devices increase in diameter, the inelastic linking element exerts a compressive force on the variable diameter devices, decreasing the distance (i.e., the pitch) between the shafts. As the variable diameter devices decrease in diameter, the inelastic linking element relaxes the compressive force on the variable diameter devices, increasing the distance between the shafts.

Close clearance hinge systems

A convertible mobile compute device comprises a lid, a base, and a hinge assembly coupled to the lid and the base. The hinge assembly includes a lid hinge bracket secured to the lid and configured to rotate about a lid hinge axis. The hinge assembly also includes a base hinge bracket secured to the base and configured to rotate about a base hinge axis. The lid hinge axis is offset from a centerline axis defined by the lid, and the base hinge axis is offset from a centerline axis defined by the base. As described herein, the offsetting of the hinge axes provides for a smaller a lid-to-base gap when the convertible mobile compute device is positioned in a closed mode relative to when the convertible mobile compute device is positioned in a tablet mode.

Offset hinge assembly for mobile compute devices

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Bengaluru, India

Prasanna Pichumani