Arista Networks, Inc.

Pranav Devalla

Prasad V Venugopal

Harold Wang

Aravind Musunuri

Steven Alf Hanssen

Jim Weaver

Theophilus Ko

Abbas Hosseinian

A network device having improved thermal cooling is provided. The network device includes a first printed circuit board (PCB) having a plurality of common connectors and one or more second PCBs, each second PCB coupled to the first PCB by a respective common connector of the plurality of common connectors. Each second PCB may include a set of ports, each port in the set of ports coupled to the respective common connector via the second PCB. The one or more second PCBs may be arranged vertically parallel on a front side of the first PCB such that each second PCB forms a 90 degree angle with the first PCB to allow air to flow in spaces defined between vertically adjacent second PCBs.

Linecard system using riser printed circuit boards (PCBS)

A network device having improved thermal cooling is provided. The network device comprising a first printed circuit board (PCB) having a plurality of common connectors and one or more second PCBs, each second PCB coupled to the first PCB by a respective common connector of the plurality of common connectors. Each second PCB may include a set of ports, each port in the set of ports coupled to the respective common connector via the second PCB. The one or more second PCBs may be arranged vertically parallel on a front side of the first PCB such that each second PCB forms a 90 degree angle with the first PCB to allow air to flow in spaces defined between vertically adjacent second PCBs.

An electronic circuit includes a first conductor configured horizontally on a first layer and a second conductor configured horizontally on a second layer. The second conductor is separated from the first conductor by a plurality of layers. A third conductor is configured between the first layer and the second layer. The third conductor electrically couples the first conductor and the second conductor. One or more intermediate conductors are electrically coupled to the third conductor, with the one or more intermediate conductors configured on one or more intermediate layers between the first layer and the second layer.

Via impedance matching

The cooling system includes a series of cooling channels arranged to provide convective cooling, with inserts for shielding electromagnetic interference (EMI) that is propagated by the waveguide nature of the cooling channels. Due to the relatively open nature, the cooling channels can serve to propagate EMI energy. The inserts mitigate the EMI exiting via these channels by attenuating or blocking the EMI. The inserts are shaped to block particular frequencies of EMI. The inserts may include thin sheet metal contoured to a half-wave profile, arranged along each cooling channel.

Growing community of inventors

Santa Clara, CA, United States of America

Pranav Devalla