Western Digital Technologies, Inc.

Pranav Balachander

John Thomas Contreras

Sayed Mobin

David Zhang

An apparatus is provided that includes a die stack having a first die and a second die disposed above a substrate, and a capacitor die disposed in the die stack between the first die and the second die. The capacitor die includes a plurality of integrated circuit capacitors that are configured to be selectively coupled together to form a desired capacitor value coupled to at least one of the first die and the second die.

Capacitor die for stacked integrated circuits

An apparatus may include a controller die and a group of dies that communicate with each other via a transmission line. The transmission line includes a first portion integrated with a printed circuit board, and a second portion that includes a plurality of wire bonds bonded to input/output pads of the group of dies. The transmission line further includes a resistor circuit connected in series with the first portion and the second portion. The resistor circuit has a resistance value that provides reduced reflection coefficients over the transmission line between the first portion and the second portion. An on-die termination resistor circuit on the controller side is removed, with the inclusion of the resistor circuit.

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Milpitas, CA, United States of America

Pranav Balachander