Oak-mitsui Inc.

Polyone Designed Structures and Solutions LLC

Oak-mitsui Technologies LLC

Ohmega Technologies Inc.

Pranabes K Pramanik

John A Andresakis

Kazuhiro Yamazaki

Loren F Temple, Jr

Jin Hyun Hwang

Daniel Brandler

Bruce Mahler

Yuji Kageyama

Fujio Kuwako

Jaclyn Radewitz

A mold includes a forming insert that includes an upper portion and a lower portion. The upper portion includes a sidewall segment and a heel segment extending from a bottom of the sidewall segment. The sidewall segment has a sidewall radius, and the heel segment has a heel radius that is less than the sidewall radius. The lower portion extends axially downward from the upper portion to define a base cavity. A forming base is positionable within the base cavity. The rim has a rim radius that is less than the heel radius and the step has a step radius that is less than the rim radius.

Methods and systems for use in forming an article from a multi-layer sheet structure

A thin laminate passive electrical device, such as, a capacitor, and a method of fabricating a thin laminate passive electrical device are provided. The passive electrical device includes two conductors, for example, copper foil conductors, separated by a dielectric having a first layer of a first material having a softening point temperature greater than a first temperature and a first layer of a second material having a softening point temperature less than the first temperature. The first temperature may be at least 150 degrees C. or higher. By providing a first layer having a higher softening point material, shorting across the conductors, that can be promoted by the fabrication process, is prevented. Methods of fabricating passive electrical devices are also disclosed.

Passive electrical devices and methods of fabricating passive electrical devices

The invention concerns multilayered constructions useful in forming capacitors and resistors, which may be used in the manufacture of printed circuit boards and microelectronic devices. A thermosetting polymer layer or layers are attached directly onto a heat resistant film layer, specifically on the side(s) of the heat resistant film to be attached to an electrically conductive layer having an electrical resistance material layer thereon. Attaching the adhesive to the heat resistant film rather than the electrically conductive layer streamlines the manufacturing process, particularly in the formation of the electrical resistance material layer onto the electrically conductive layer. This also results in better precision and uniformity of the multilayered construction.

Multilayered construction for use in resistors and capacitors

Polymer-ceramic composite materials for use in the formation of capacitors, which materials exhibit very low changes in temperature coefficient of capacitance (TCC) in response to changes in temperature within the range of from about &#x2212;55&#xb0; C. to about 125&#xb0; C. Specifically, these capacitor materials have a change in TCC ranging from about &#x2212;5% to about +5%, in response to changes in temperature within the desired temperature range. The inventive composite materials comprise a blend of a polymer component and ferroelectric ceramic particles, wherein the polymer component includes at least one epoxy-containing polymer, and at least one polymer having epoxy-reactive groups. The inventive polymer-ceramic composite materials have excellent mechanical properties such as improved peel strength and lack of brittleness, electrical properties such as high dielectric constant, and improved processing characteristics.

Polymer-ceramic composites with excellent TCC

The invention concerns a method of making multilayered constructions useful in forming capacitors and resistors, which may be used in the manufacture of printed circuit boards and microelectronic devices. According to the inventive method, a thermosetting polymer layer or layers are attached directly onto a heat resistant film layer, specifically on the side(s) of the heat resistant film to be attached to an electrically conductive layer having an electrical resistance material layer thereon. Attaching the adhesive to the heat resistant film rather than the electrically conductive layer streamlines the manufacturing process, particularly in the formation of the electrical resistance material layer onto the electrically conductive layer. This also results in better precision and uniformity of the multilayered construction.

Method of making multilayered construction for use in resistors and capacitors

The invention concerns multilayered structures useful for forming capacitors, which may be embedded within printed circuit boards or other microelectronic devices. The multilayered structure comprises a pair of parallel electrically conductive layers separated by a pair of dielectric layers and a central polymerizable layer. Each of the dielectric layers and the central layer may include a filler. Capacitors formed from the multilayered structures of the invention exhibit excellent short circuit resistance as well as excellent void resistance.

Thin laminate as embedded capacitance material in printed circuit boards

The invention concerns multilayered constructions useful for forming resistors and capacitors, for the manufacture of printed circuit boards or other microelectronic devices. The multilayered constructions comprise sequentially attached layers comprising: a first electrically conductive layer, a first thermosetting polymer layer, a heat resistant film layer, a second thermosetting polymer layer, and a nickel-phosphorus electrical resistance material layer electroplated onto a second electrically conductive layer.

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Clifton Park, NY, United States of America

Pranabes K Pramanik