Advanced Micro Devices Corporation

Pranabendra Sarma

Valerie Vivares

Robert A Newman

Alexander C Tain

A method and software relating to determining whether a square die fits into a package without generating drawings. Package parameters are defined and used to calculate die characteristics. Calculated die characteristics are compared to defined package parameters and/or to calculated package parameters to make a determination of whether a die with the calculated characteristics fits into a package as defined by its parameters. The method and software allow design of dies to fit packages, the design of packages to fit dies, and simultaneous design of dies and packages that fit one another.

Design tool for integrated circuit design

A novel method is provided for checking BGA substrate design made using an APD design tool. User's netlist containing information on a die to be mounted on the BGA substrate is entered into an interface software system providing an interface to the APD design tool. The interface software system extracts the design netlist generated from the APD design of the BGA substrate, and compares this netlist to the user's netlist. If no differences are reported, the BGA substrate design is considered to be correct.

Growing community of inventors

San Jose, CA, United States of America

Pranabendra Sarma