Advanced Micro Devices Corporation

Pramod D Patel

Richard C Blish

Colin D Hatchard

David E Lewis

Method for stepping identification and bond pad crater jeopardy identification in integrated circuits and apparatus which performs the method, A unique device, a polysilicon meander, is formed under each bond pad in the integrated circuit device. Connected to the meander is circuitry for determining the electrical, and hence mechanical, integrity of the meander. Failure of the meander by reason of microcrack formation in the several layers under the meander is detected by the high resistance of the meander. The circuitry will also resolve any potential mismatch between the actual mask revision of the integrated circuit and the corresponding revision of the test program.

Method and apparatus to achieve bond pad crater sensing and stepping identification in integrated circuit products

Barrier structures are included within the packaging material of a packaged semiconductor device, such barrier structures including barrier bodies which overlie the die-die pad assembly of the device on either side thereof. The barrier bodies act as baffles which limit diffusion of moisture through the packaging material into the area of the die-die pad assembly of the device, the barrier bodies including apertures therethrough which control such diffusion in a manner that avoids delamination problems in the area of the die-die pad assembly, meanwhile also avoiding undesirable trapping of gas within the packaging material.

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San Jose, CA, United States of America

Pramod D Patel