Seagate Technology Incorporated

Pramit P Parikh

Joel William Hoehn

Leping Li

Mark Allen Herendeen

Saravuth Keo

Roger L Hipwell

Raymond Leroy Moudry

Jeff O'Konski

Jeffrey Robert O'Konski

John L Ibele

Edward Alan Knutson

Kara L Maytag

Joe J Schobel

Ralph Marquart

A data storage device may be tested during or after manufacture by a testing device that may have at least a work piece with at least one contact pad concurrently contacting bottom and sidewall surfaces of a probe tip with a centering feature of the at least one contact pad.

Work piece contact pad with centering feature

A device and associated method of use can have at least an object with a work surface that contacts a lapping surface of a tool. Topography of the lapping surface can be mapped in-situ by an adjacent sensor array and the topography stored in a memory. The sensor array may be configured with a plurality of sensors positioned on opposite sides of the object.

In-situ lapping plate mapping device

The presently disclosed technology describes systems and methods for attaining a ball bond using less than 1 thousandth of an inch diameter gold wire using ultrasonic bonding energy and without heating an underlying bonding pad. The ball bond allows the use of particularly small bonding pads that are particularly close to adjacent microelectronic structures that limit the use of other bonding techniques that have shallow take-off angles.

Ambient temperature ball bond

Growing community of inventors

Eden Prairie, MN, United States of America

Pramit P Parikh