Cypress Semiconductor Corporation

Prakash R Krishanan

Christopher A Seams

Yonghong Yang

Clifford P Sandstrom

A method for arranging a semiconductor wafer within a photolithography tool and methods for processing a semiconductor wafer employing such an arrangement process are provided. The arrangement process includes positioning a semiconductor wafer on a stage in a pre-alignment unit of a photolithography tool such that a crystal orientation marker of the wafer is located at a first radial position. Thereafter, the wafer is moved to an exposure unit of the photolithography tool. During one or both of such steps, the semiconductor wafer is rotated such that the crystal orientation marker is relocated to a second, distinct radial position prior to arranging the wafer upon a stage of the exposure unit. In particular, the semiconductor wafer is rotated greater than approximately 10&#xb0; and less than approximately 170&#xb0; relative to the first radial position. The arrangement process is performed for lithography processes conducted during fabrication of a semiconductor device.

Growing community of inventors

Milpitas, CA, United States of America

Prakash R Krishanan