International Business Machines Corporation

Prakash Nahata

William A Brady

Rolf G Meinert

See Ark Chan

Julius J Perlini

Norbert Freisitzer

Mario G Tavares

Douglas A West

A dry film photoresist laminator includes a punch and die assembly 24 which punches a rolled sheet dry film photoresist material 14, that is comprised of a dry film photoresist material 18 sandwiched between a Mylar top layer 16 and a polyolefin bottom layer 20, into photoresist decals. The photoresist decals are bonded to a tacky transport tape 40 which carries the decals to a polyolefin peeler assembly 54 that rolls a high tack tape 57 along the polyolefin layer 20 of the decal, thereby peeling it from the decal. The decal is advanced by a laminating assembly 44 which rolls the decal onto a heated wafer 72, thereby bonding the exposed photoresist material 18 to the wafer 72. Bonded wafer 72 and decal 14 are removed from the transport tape 40. A tape transport assembly 44 carrying the transport tape and decal is advanced through the various process steps.

Photo resist film application mechanism

Growing community of inventors

Coral Springs, FL, United States of America

Prakash Nahata