Intel Corporation

Prakash Kurma Raju

Prasanna Pichumani

Bijendra Singh

Kathiravan D

Raghavendra Doddi

Jeff Ku

Juha Paavola

Jayprakash Thakur

Gustavo Fricke

Hari Shanker Thakur

Babu Triplicane Gopikrishnan

Gokul V Subramaniam

Gopinath Kandasamy

Bala P Subramanya

Ritu Bawa

Aleksander Magi

Harry G Skinner

Mark Charles Carbone

Arvind Sundaram

David Pidwerbecki

Vivek Paranjape

Gavin Sung

Samarth Alva

Arnab Sen

Justin Michael Huttula

Navneet Kumar Singh

Harish Jagadish

Lance Lin

Maruti Tamrakar

Jason Y Jiang

Sachin Bedare

Evan Piotr Kuklinski

Christopher M Moore

Sumod Cherukkate

Smit Kapila

Gerry Juan

Nehakausar Shaikh Ramjan Pinjari

Vijith Halestoph R

Akarsha Rajeshwar Kadadevaramath

Naoki Matsumura

Daniel J Ragland

Srikanth Potluri

Soethiha Soe

Tim Liu

Hua Yang

Marko Bartscherer

Ayeshwarya B Mahajan

Mikko Antero Makinen

Praveen Kumar

Kannan G Raja

Baomin Liu

Sean J W Lawrence

Jagadish Vasudeva Singh

Xiyong Tian

Ruander Cardenas

Twan Sing Loo

Jia Yan Go

Columbia Mishra

Sagar Gupta

Santhosh Ap

Vamshi Krishna Aagiru

Yagnesh Vinodrai Waghela

Chin Kung Goh

Vinay Kumar Chandrasekhara

Triplicane Gopikrishnan Babu

Ajay Kumar Vaidhyanathan

Nehakausar Pinjari

Mikko Makinen

Sammi Wy Liu

Khal Ern See

Bhavaneeswaran Anbalagan

Madhurkiran Sreenivasa Reddy

Penchala Pratap Binni Boyina

Raghavendra S Kanivihalli

Abhishek Srivastav

George Baoci Sun

Varshini Ajjampur Vijayakumar

Deepak Sekar

Wan Yu Liu

Srinivas Rao Konakalla

Sudheera Sudhakar

Nithesha Ananda

Cora Nien

Javed Shaikh

Zaman Zaid Mulla

Chun-Ting Liu

Shih Wei Nien

Gurpreet Singh Sandhu

Ravishankar Srikanth

Ajesh K K

Gopinath K

Cooling systems with heat pipes for electronic devices are disclosed herein. An example cooling system includes a heat pipe having a top wall and a bottom wall. The heat pipe contains a fluid. The cooling system includes a wick disposed in the heat pipe and a stiffener coupled to the wick. The stiffener contacts the top wall and the bottom wall of the heat pipe.

Cooling systems with heat pipes for electronic devices

An example electronic device is disclosed that includes a printed circuit board, an electronic component coupled to the printed circuit board, and a solderless shield coupled to the printed circuit board and covering the electronic component.

Solderless or groundless electromagnetic shielding in electronic devices

Disclosed herein is an encapsulated antenna for reducing the impact of radio frequency interference (RFI) that may couple to the antenna at frequencies within the Wi-FI 5/6e bandwidths. The encapsulated antenna device may include an insulating housing and a metal layer arranged within a cavity of the housing. The encapsulated antenna device also includes an antenna device comprising a ground terminal and an antenna body, wherein the ground terminal is connected to the metal layer, wherein the antenna body is arranged above the metal layer and within the cavity. The encapsulated antenna device also includes a spacer between the metal layer and the antenna body that provides an offset distance between the metal layer and the antenna body.

Encapsulated wireless antenna for reducing the impact of radio frequency interference

Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a keyboard, and a chassis, where a portion of the chassis is between the substrate and the keyboard. A transmission line is embedded in the portion of the chassis between the substrate and the keyboard. In some examples, the portion of the chassis between the substrate and the keyboard that includes the transmission line is a support plate for the keyboard.

Transmission line embedded in a portion of a chassis of an electronic device

Techniques for illumination of input/output (I/O) ports on a compute device are disclosed. In an illustrative embodiment, microholes are defined in a chassis around an opening in the chassis for an I/O port. A light-emitting diode (LED) contained within the chassis can shine light on the microholes, which can pass through the microholes. A user of the compute device can see the light through the microholes, allowing the user to identify the location and type of the I/O port, even in dark or low-light conditions. In some embodiments, the LEDs used to illuminate the microholes may be the same LEDs that illuminate the keys of the keyboard, simplifying the design, construction, and control of illumination of the microholes.

Technologies for illumination of input/output ports on a compute device

Keyboards for electronic devices with keys having integrated speakers are disclosed herein. An example keyboard includes a key having a key cap and a speaker coupled to the key cap. The speaker is disposed in or at least partially covered by the key cap.

Keyboards for electronic devices with keys having integrated speakers

Techniques for video conferencing are disclosed. In one embodiment, a mirror assembly can be used to position a mirror in front of a camera, reflecting a view of the camera downward towards a whiteboard or other drawing surface, allowing a user to show a drawing during a video conference. In another embodiment, video data and audio data of a user in a video conference can be analyzed to determine what portions of the video data and audio data should be transmitted to a remote participant in the video conference. Unintentional input supplied by the user in the video data and audio data may be used to determine which portions of the video data and audio data to transmit.

Technologies for video conferencing

An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices

Techniques for battery retention are disclosed. In the illustrative embodiment, a thin polyurethane strap is used to hold a battery in place. The strap only requires a small amount of volume, allowing for a higher volume (and higher capacity) for the battery. In order to accommodate swelling, a computing device that has a battery held in place with such a strap can have an open area above the battery. The strap may have ridges to contact the battery and the component above the battery beyond the open area. If the battery swells, the ridges may be pressed down, accommodating the swelling battery.

Technologies for battery retention

Example slot antennas for electronic user device and related methods are disclosed herein. An example electronic user device includes a first housing; a second housing rotatably coupled to the first housing; a display screen carried by the second housing; a dual-band antenna carried by the second housing; and a bezel about the display screen, the bezel to cover the dual-band antenna.

Slot antennas for electronic user devices and related methods

An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.

Hinge assembly and guide assembly for electronic devices using a heat carrying member

Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, one or more heat sources over the substrate, one or more heat pipes thermally coupled to the one or more heat sources, a heat spreader coupled to the one or more heat pipes, where the heat spreader is in-plane with the heat pipe, and one or more loading mechanisms coupled to at least a portion of the one or more heat pipes and to the substrate. The one or more loading mechanisms are in-plane with the spreader and the one or more heat pipes.

Heat pipe with in-plane heat spreader and loading mechanism

Thermally conductive shock absorbers for electronic devices are disclosed. An electronic device includes a housing and a hardware component positioned inside the housing. A thermally conductive shock absorber is located between an inner surface of the housing and the hardware component. The thermally conductive shock absorber including an impact absorbing material and a thermal conductive material being in contact with at least a portion of the impact absorbing material.

Thermally conductive shock absorbers for electronic devices

There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension dof the rectangular form factor is at least approximately twice a first dimension dof the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second dedges of the planar vapor chamber, further disposed to conduct heat from the first and second dedges to the first and second fan respectively.

Vapor chambers

Particular embodiments described herein provide for an electronic device that can be configured to include a fan where the fan blades are decoupled from the center shaft. The fan can include a center shaft, a motor coil support, motor coils coupled to the motor coil support, a rotator coupled to the center shaft, and fan blades coupled to the rotator, where rotation of the fan blades is decoupled from the center shaft by the rotator. A blade support can be coupled to the rotator, where the blade support couples the fan blades to the rotator and magnets can be coupled to the blade support. In an example, the rotator can include an inner, an outer race, and bearings.

Fan support

Growing community of inventors

Bengaluru, India

Prakash Kurma Raju