Applied Materials, Inc.

Kateeva, Inc.

Prahallad Iyengar

Sanjeev Baluja

Alexander Sou-Kang Ko

Eliyahu Vronsky

Justin Mauck

Dhritiman Subha Kashyap

Digby Pun

Kartik Bhupendra Shah

Chaowei Wang

Joseph Aubuchon

Janisht Golcha

Li-Qun Xia

Juan Carlos Rocha-Alvarez

Thomas E Nowak

Derek R Witty

Mei-Yee Shek

Vladimir Zubkov

Scott A Hendrickson

Satish Radhakrishnan

Robert Dennis Taff

Yong-Won Lee

Parth Swaroop

Gas distribution plate

Dual channel showerhead assemblies are described. In some embodiments, the dual channel showerhead assemblies, which include a showerhead upper plate and a showerhead lower plate, enable delivery of mutually incompatible precursors along separate channels that mix in the process zone above a wafer. The dual channel showerhead assemblies provide at least two separate gas paths. In some embodiments, the hole design and hole distribution are configured for minimal jetting effect and plenum volumes for fast purging. The dual channel showerhead assemblies described herein may have a reduced purge out time compared to single channel showerheads, spiral dual channel showerheads, and bonded dual channel showerheads.

Dual channel showerhead assembly

What is disclosed herein are embodiments of an enclosed manufacturing system configured to provide a controlled process environment for various articles of manufacture requiring a controlled process environment, and additionally to contain a process environment within the enclosure during periods of external access to the interior of the enclosed manufacturing system. Various embodiments of manufacturing systems of the present teaching can contain the environment within a manufacturing enclosure so as to minimize the interaction of an environment external to a manufacturing enclosure with the internal enclosure environment.

Manufacturing enclosure environmental containment systems and methods

The present teachings relate to various embodiments of a gas enclosure system that can have a particle control system that can include a multi-zone gas circulation and filtration system, a low-particle-generating X-axis linear bearing system for moving a printhead assembly relative to a substrate, a service bundle housing exhaust system, and a printhead assembly exhaust system. Various components of a particle control system can include a tunnel circulation and filtration system that can be in flow communication with bridge circulation and filtration system. Various embodiments of a tunnel circulation and filtration system can provide cross-flow circulation and filtration of gas about a floatation table of a printing system. Various embodiments of a gas enclosure system can have a bridge circulation and filtration system that can provide circulation and filtration of gas about a printing system bridge and related apparatuses and devices. Accordingly, various embodiments of a gas circulation and filtration system as disclosed herein can effectively remove both airborne particulate matter, as well as particulate matter generated proximal to a substrate during a printing process. As such, various embodiments of a gas circulation and filtration system in conjunction with various embodiments of a gas purification system of the present teachings can provide for a controlled manufacturing environment resulting in a high-yield of OLED various devices.

Gas enclosure systems and methods utilizing multi-zone circulation and filtration

A silicon dioxide layer is deposited onto a substrate using a process gas comprising BDEAS and an oxygen-containing gas such as ozone. The silicon dioxide layer can be part of an etch-resistant stack that includes a resist layer. In another version, the silicon dioxide layer is deposited into through holes to form an oxide liner for through-silicon vias.

Silicon dioxide layer deposited with BDEAS

Growing community of inventors

Santa Clara, CA, United States of America

Prahallad Iyengar