Sandisk Semiconductor (shanghai) Co. Ltd.

Sandisk Information Technology (shanghai) Co., Ltd.

Pradeep Rai

Li Ping Wang

Jianhua Wang

Peng Lu

Junrong Yan

Weili Wang

Kim Lee Bock

Xin Lu

King Hoo Ong

JinXiang Huang

Enyong Tai

Jianbin Gu

A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. A spacer layer is also mounted to the substrate, with the semiconductor die fitting within an aperture or a notch formed through first and second major opposed surfaces of the spacer layer. Additional semiconductor die, such as flash memory die, may be mounted atop the spacer layer.

Spacer layer for embedding semiconductor die

A tool is disclosed for separating a semiconductor die from a tape to which the die is affixed during the wafer dicing process. The tool includes a pick-up arm for positioning a vacuum tip over a semiconductor die to be removed. The vacuum tip includes a non-uniform array of vacuum holes to grip the semiconductor wafer.

Non-uniform vacuum profile die attach tip

Growing community of inventors

Jangipur, India

Pradeep Rai