Ormet Corporation

Ormet Circuits, Inc.

Pradeep R Gandhi

Lutz W Brandt

Goran S Matijasevic

Xiaomei Xi

M Albert Capote

Catherine A Gallagher

Daniel E Baxter

Goran Matijavesic

Sam Fu

William C Robinette

Catharine Gallagher

Gary E Legerton

Samuel Fu

Bryan Shearer

Disclosed are electrical connector devices with integrated electronic components, including magnetic devices. The electronic components integrated into the connector are electrically connected to one another and the connector pins by an electrically conductive circuit formed directly on the connector housing. Formation of the electrically conductive circuit directly on the connector housing substantially reduces the number of assembly steps required to manufacture the connector.

Method of attaching circuitry to a modular jack connector using electrically conductive paste

Methods for the production of insulated, conductive through-features in conductive core materials for electronics packaging are disclosed. Invention methods employ protective mask technology in order to facilitate the selective removal of material from planar conductive core material that has been encapsulated in electrically insulated materials. By filling the cavity in the conductive core material with an electrically insulated material, the through-feature is electrically isolated from the remainder of the core material. In this manner, a conductive through-feature that completely transverses the core of the substrate board is created. Also provided are planar substrates for multilayer printed circuit boards, or chip carriers, comprising the conductive through-features produced by invention methods.

Methods to produce insulated conductive through-features in core

A method of fabricating individual, embedded capacitors in multilayer printed circuit boards is disclosed. The method is compatible with standard printed circuit board fabrication. The capacitor fabrication is based on a sequential build-up technology employing a first patternable insulator. After patterning of the insulator, pattern grooves are filled with a high dielectric constant material, typically a polymer/ceramic composite. Capacitance values are defined by the pattern size, thickness and dielectric constant of the composite. Capacitor electrodes and other electrical circuitry can be created either by etching laminated copper, by metal evaporation or by depositing conductive ink.

Individual embedded capacitors for laminated printed circuit boards

In accordance with the present invention, there are provided novel metal-containing compositions useful for the preparation of electrical resistance devices (e.g., resistors and thermistor elements). Compositions according to the invention comprise at least one low melting point metal material, and optionally a higher melting point metal material, with the further presence of a binder system also being optional. Compositions according to the invention exhibit a wide range of resistivity and a wide range of values for temperature coefficient of resistance (TCR). Compositions with low values for TCR are useful for resistor applications while compositions with large values for TCR are useful for thermistor applications. Resistor or thermistor elements can be produced by applying compositions according to the invention onto suitable substrates and subsequently alloying (i.e., curing and/or sintering) the compositions. During curing/sintering, the metal or metal alloy powders undergo transient liquid phase sintering to form a continuous metallurgical network. The electrical conduction of the resulting resistor and/or thermistor elements is achieved as a result of the continuous metallurgical network. Resistance and values for TCR of resistors and/or thermistors prepared employing compositions according to the invention are dependent on the intermetallic compounds formed as a result of the alloying/sintering process. Resistors and thermistor elements formed employing compositions according to the invention are stable up to approximately 250.degree. C. and can be used in the temperature range of about -50.degree. C. up to about 200.degree. C. These metal-containing compositions are compatible with polymer, metal and other types of substrates, are highly reliable as compared to existing technology.

Metal-containing compositions and uses thereof, including preparation of

In accordance with the present invention, there are provided novel vertically interconnected assemblies and compositions useful therefore. Invention assemblies comprise substrate boards with multiple layer electronic assemblies. The multiple layers comprise individual layers of circuitry separated and adhered by dielectric materials selectively coated and/or filled with a transient liquid phase sintered (TLPS) material. The TLPS is formulated to be electrically conductive, and thereby serves to convey current between the layers of circuitry. In addition, the TLPS is easily workable so that it is amenable to automated, stepwise construction of multilayer circuitry without the need for labor intensive drilling and filling of conductive vias.

Vertically interconnected electronic assemblies and compositions useful

In accordance with the present invention, it has been discovered that conductive traces made from transient liquid phase sintering (TLPS) pastes, plated by electroless or electrolytic means, result in improved solderability, adhesion and conductivity of the circuitry. Transient liquid phase sintering pastes employed in the practice of the present invention differ from conventional metal loaded polymer thick film (PTF) inks in that they contain, in addition to a binder, they also contain both a relatively high melting metal powder and a relatively low melting solder powder capable of forming a continuous intermetallic/metallic phase after sintering. The present invention is particularly useful, for example, for the fabrication of single and multi-layer printed circuit boards, providing horizontal and vertical conductive interconnects, metallized through-holes, and conductive pads for electronic component attachment.

Growing community of inventors

Del Mar, CA, United States of America

Pradeep R Gandhi