Intel Corporation

Pradeep Prabhakaran

Yen-Cheng Liu

Swadesh Choudhary

Brinda Ganesh

Tejpal Singh

Monam Agarwal

In one embodiment, a system on chip includes: a plurality of intellectual property (IP) agents formed on a semiconductor die; a mesh interconnect formed on the semiconductor die to couple the plurality of IP agents, and a plurality of mesh stops each to couple one or more of the plurality of IP agents to the mesh interconnect. The mesh interconnect may be formed of a plurality of rows each having one of a plurality of horizontal interconnects and a plurality of columns each having one of a plurality of vertical interconnects;, where at least one of the plurality of rows includes an asymmetrical number of mesh stops. Other embodiments are described and claimed.

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Holden, MA, United States of America

Pradeep Prabhakaran