International Business Machines Corporation

Globalfoundries Inc.

Apple Inc.

Prabjit Singh

Michael J Ellsworth, Jr

Roger R Schmidt

Levi A Campbell

Richard C Chu

Robert E Simons

Madhusudan K Iyengar

Jing Zhang

Milnes P David

Levente Klein

Howard Victor Mahaney, Jr

Sukhvinder Singh Kang

Egidio E Marotta

Hendrik F Hamann

Michael Alan Schappert

Emanuele F Lopergolo

Mark Kenneth Hoffmeyer

Jason T Wertz

Dylan J Boday

John G Torok

Dustin W Demetriou

Daniel J Kearney

Michael J Domitrovits

George T Galyon

Joseph Paul Kuczynski

David Clifford Long

Budy D Notohardjono

Noah B Singer

Gary Franklin Goth

Phillip Duane Isaacs

Frank Louis Pompeo

John J Loparco

S Jay Chey

David P Graybill

Jason R Eagle

Christopher Michael Marroquin

Bret W Lehman

Randall G Kemink

Steve Ostrander

Jeffrey A Newcomer

Enrico A Romano

Steven J Mazzuca

Daren Simmons

King M Chu

Michael G Betro

H John Healey

Theodore Gerard Van Kessel

Charles Leon Arvin

Supratik Guha

Yves Corfield Martin

David L Edwards

Sushumna Iruvanti

Edward Joseph Seminaro

Bruce John Chamberlin

Dennis R Barringer

Steven Paul Ostrander

Michael D Hillman

Steven C McIntosh

Timothy Matthew Trifilo

Rajneesh Kumar

Harold M Toffler

Gregory L Tice

Steven John Ahladas

William P Kostenko

Melissa K Miller

Heidi D Williams

Gerald J Fahr

Joseph James George

Richard Lidio Blanco

Gerard Vincent Weber, Jr

Ronald Jack Smith

Robert F Florence, Jr

Richard A Johnson

Frank E Bosco

Howell B Schwartz

Sean A Bailey

Paul A Zucco

Basil D Washo

Phillip Lee Mort

William M Lorenz

Tuan D Ngo

Lawrence Palmer

Gerard V Weber

Lenas J Hedlund

Yiping Yao

Victor A Ronken

John P McConnell

Applying a solderable surface to conductive ink may include partially curing a conductive ink trace; applying, to the partially cured conductive ink trace, a conductive paste comprising conductive particles; and curing the partially cured conductive ink trace and the conductive paste.

Applying a solderable surface to conductive ink

A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.

Fixture facilitating heat sink fabrication

An air-to-coolant heat exchanger for an electronics rack is provided, which includes first and second tube segments, one or more connector segments, and a plurality of thermally conductive fins attached to the tube segments. The first tube segment includes a first inner tube positioned within a first outer tube, defining a first inner coolant-carrying channel and first outer coolant-carrying channel, and the second tube segment has a second inner tube positioned within a second outer tube, defining a second inner coolant-carrying channel and second outer coolant-carrying channel. The connector segment(s) couples in fluid communication at least one of the first and second inner coolant-carrying channels, or the first and second outer coolant-carrying channels. The heat exchanger is coupled to separately receive a first coolant and a second coolant, with the first coolant passing through the inner channels, and the second coolant through the outer channels.

Multi-coolant heat exchanger for an electronics rack

A deionized-water cooling system for electrical equipment is provided. The system includes a cooling loop in which water comes into contact with the electrical equipment and a deionization bypass connected to the cooling loop. The deionization bypass includes a first filter component configured to remove dissolved oxygen, a second filter component configured to filter solid particles, a deionization cartridge configured to deionize water, and a plurality of valves configured to control a water flow within the deionization bypass.

Deionized-water cooling for electrical equipment

Filing a plated through-hole of a circuit board with solder is facilitated by an apparatus which includes a wire solder assembly and a controller. The wire solder assembly includes a wire probe sized to extend into the plated through-hole from one side of the circuit board, and a solder block associated with the wire probe so that the probe passes through the solder block. The controller controls heating of the wire probe, when the wire probe is operatively inserted into the plated through-hole, by passing a current through the wire probe. The heating of the wire probe heats a conductive plating of the plated through-hole and melts the solder block. The heating of the conductive plating and the melting of the solder block causes the solder to migrate into the plated through-hole by capillary action to fill the plated through-hole with the solder.

Facilitating filling a plated through-hole of a circuit board with solder

A battery pack is provided which includes an enclosure. The enclosure includes a battery cell compartment and a vent. The battery cell compartment is a sealed compartment, except for the vent, and the vent facilitates pressure-induced venting of gas from the battery cell compartment. One or more battery cells are disposed within the battery cell compartment, and the battery pack also includes a filter system associated with the enclosure. The filter system filters the pressure-induced venting of gas from the battery cell compartment resulting from a thermal runaway event at a battery cell of the one or more battery cells within the battery cell compartment of the enclosure.

Pressure-induced battery pack venting with filtering

A method for repairing a through-hole includes inserting a repair coil, comprising a tightly-wound repair strip, into a through-hole and inserting a heating element into the repair coil. Passing an electrical current through the heating element liquefies a bonding material disposed on the repair coil and the repair coil expands within the through-hole. Subsequently solidifying the bonding material bonds the repair coil to the through-hole. A repair assembly comprises a repair coil inserted into a through-hole and a heating element inserted into the repair coil. The repair coil comprises a tightly-wound repair strip. The heating element comprises a segment of a heating wire enclosed within an insulating material. Passing an electric current through the segment of the heating wire liquefies bonding material disposed on the repair coil and the repair coil expands within the through-hole. The liquified bonding material solidifies to bond the repair coil to the through-hole.

Repairing defective through-holes

A spot welding-type system is provided adapted to facilitate evaluating a rechargeable battery. The system includes first and second electrodes to contact the rechargeable battery. The first electrode includes a first contact surface to facilitate inducing an internal short circuit within the rechargeable battery during operation of the spot welding-type system, and the second electrode includes a second contact surface to contact the rechargeable battery. The first and second contact surfaces are dissimilar contact surfaces, and the second contact surface is larger than the first contact surface. The system with the rechargeable battery disposed between the first and second contact surfaces produces, in operation, a localized pressure on, and a localized heating of, the rechargeable battery in a spot-sized region where the first contact surface contacts the rechargeable battery to facilitate generating and evaluating a potential internal short circuiting of the rechargeable battery.

Apparatus for facilitating evaluating rechargeable batteries

Shape-memory alloy connectors and methods are provided for enhancing conductivity of a plated through-hole of a circuit board. A shape-memory alloy connector, including a shape-memory alloy material in deformed shape, is inserted into the plated through-hole of the circuit board. The shape-memory alloy connector is expanded within the plated through-hole by heating the shape-memory alloy material to, at least in part, transition the shape-memory alloy material towards a pre-deformed shape of the material. The transitioning of the shape-memory alloy material towards the pre-deformed shape expands the shape-memory alloy connector outward, at least in part, against plating of the plated through-hole to enhance contact of the shape-memory alloy connector with the plating of the plated through-hole.

Shape-memory alloy connector for plated through-hole

Liquid-cooled heat sink assemblies are provided which include: a heat transfer element including a heat transfer base with opposite first and second sides and a plurality of thermally conductive fins extending from the first side, and with the second side of the heat transfer base to couple to a component(s) to be cooled. The heat sink assembly further includes a coolant-carrying structure attached to the heat transfer element. The coolant-carrying structure includes a coolant-carrying base, and a coolant-carrying compartment through which liquid coolant flows. The coolant-carrying base includes a plurality of fin-receiving openings sized and positioned for the plurality of thermally conductive fins to extend therethrough. The plurality of thermally conductive fins extend into the coolant-carrying compartment through which the liquid coolant flows. In one or more embodiments, the heat transfer element is a metal structure and the coolant-carrying structure is a plastic structure.

Liquid-cooled, composite heat sink assemblies

A method includes measuring a leakage current through a particulate matter sample in a humidity chamber, the leakage current is measured as a relative humidity in the humidity chamber is incrementally increased, and plotting a logarithm of the measured leakage current as a function of the relative humidity. The plot of the logarithm of the measured leakage current as a function of the relative humidity has an inversion region, a low relative humidity region, and a high relative humidity region.

Measurement of particulate matter deliquescence relative humidity

Formed hose configurations are provided which include an innermost elastomer layer, a first fiber-reinforcement region, and multiple second fiber-reinforcement regions. The first fiber-reinforcement region has a first fiber-reinforcement density, and is disposed, at least in part, at a bend region of the formed hose, and the multiple second fiber-reinforcement regions have a second fiber-reinforcement density, and are disposed at least at the first and second end regions of the formed hose. The second fiber-reinforcement density is greater than the first fiber-reinforcement density, and results in the first and second ends of the formed hose being less radially-deformable than the bend region of the hose. This facilitates providing a mechanical fluid-tight connection with a hose barb fitting when the formed hose is slid over the hose barb fitting, absent any clamp over the formed hose and hose barb fitting connection.

Formed hose with different fiber-reinforced regions

A metal block has a joint element. The joint element is defined between a trench in an outer surface of the metal block and a hole extending from the outer surface of the metal block to the interior space. The trench is configured such that when heat is applied to the joint element the trench reduces dissipation of the heat throughout the metal block. The hole is configured to receive a metal tube.

Heat stop for brazing or soldering

Growing community of inventors

Poughkeepsie, NY, United States of America

Prabjit Singh