H.c. Starck Gmbh

Other

Metal Matrix Cast Composites, Inc.

H.c. Stark Inc.

Prabhat Kumar

Steven Alfred Miller

Richard Wu

Gary Alan Rozak

Shuwei Sun

David Meendering

Paul R Aimone

Rong-Chein Richard Wu

Joseph Hirt

Timothy Welling

James G Daily, Iii

Brad Lemon

Stefan Zimmermann

Peter R Jepson

Olaf Schmidt-Park

Mark E Gaydos

James A Cornie

Steve Miller

Norman C Mills

Henry F Breit

Gerhard Gille

Jerome O'Grady

Henning Uhlenhut

Rong-chein Richard Wu

Howard V Goldberg

Richard R Malen

David G Schwartz

John E Shields

Stephen S Cornie

Thomas J Ryan

Hank Breit

Larry Ballard

Robert Desberg

Gerhard Wötting

Robert W Balliett

Lawrence F McHugh

Stefan Zimmerman

Anthony V Parise

Charles Wood

Thomas M Ramlow

Glen Zeman

David G Schwarz

Davd G Schwarz

Richard Nicholson

John A Shields

James Daily

Charles B Wood

James G Iii Daily

Jerone O´Grady

In various embodiments, sputtering targets are formed by introducing molybdenum powder into a sheet bar mold, pressing the powder to form a sheet bar, sintering the sheet bar to form an ingot having a density of at least 90% of a theoretical density, preheating the ingot, rolling the ingot to form a plate, and heat treating the plate.

Methods of forming molybdenum sputtering targets

In various embodiments, a sputtering target initially formed by ingot metallurgy or powder metallurgy and rejuvenated by, e.g., cold spray, is utilized in sputtering processes to produce metallic thin films.

Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom

A niobium or niobium alloy which contains pure or substantially pure niobium and at least one metal element selected from the group consisting of Ru, Rh, Pd, Os, Ir, Pt, Mo, W and Re to form a niobium alloy that is resistant to aqueous corrosion. The invention also relates to the process of preparing the niobium alloy.

Niobium based alloy that is resistant to aqueous corrosion

In various embodiments, tubular sputtering targets comprising molybdenum are provided and sputtered to produce thin films comprising molybdenum. The sputtering targets may be formed by forming a tubular billet having an inner diameter IDand an outer diameter OD, the formation comprising pressing molybdenum powder in a mold and sintering the pressed molybdenum powder, working the tubular billet to form a worked billet having an outer diameter ODsmaller than OD, and heat treating the worked billet. The sputtering targets may have a substantially uniform texture of (a) a 110 orientation parallel to a longitudinal direction and (b) a 111 orientation parallel to a radial direction.

Methods of depositing thin films using molybdenum sputtering targets

In various embodiments, planar sputtering targets are produced by forming a billet at least by pressing molybdenum powder in a mold and sintering the pressed powder, working the billet to form a worked billet, heat treating the worked billet, working the worked billet to form a final billet, and heat treating the final billet.

Molybdenum titanium sputter targets are provided. In one aspect, the targets are substantially free of the &#x3b2;(Ti, Mo) alloy phase. In another aspect, the targets are substantially comprised of single phase &#x3b2;(Ti, Mo) alloy. In both aspects, particulate emission during sputtering is reduced. Methods of preparing the targets, methods of bonding targets together to produce large area sputter targets, and films produced by the targets, are also provided.

Methods of making molybdenum titanium sputtering plates and targets

In various embodiments, a sputtering target initially formed by ingot metallurgy or powder metallurgy and comprising a sputtering-target material is provided, the sputtering-target material (i) comprising a metal, (ii) defining a recessed furrow therein, and (iii) having a first grain size and a first crystalline microstructure. A powder is spray-deposited within the furrow to form a layer therein, the layer (i) comprising the metal, (ii) having a second grain size finer than the first grain size, and (iii) having a second crystalline microstructure more random than the first crystalline microstructure. Spray-depositing the powder within the furrow forms a distinct boundary line between the layer and the sputtering-target material.

Methods of rejuvenating sputtering targets

The present invention is directed to a process for producing high density, refractory metal products via a press/sintering process. The invention is also directed to a process for producing a sputtering target and to the sputtering target so produced.

High density refractory metals and alloys sputtering targets

In various embodiments, a sputtering target initially formed by ingot metallurgy or powder metallurgy and comprising a sputtering-target material is provided, the sputtering-target material (i) comprising a refractory metal, (ii) defining a recessed furrow therein, and (iii) having a first grain size and a first crystalline microstructure. A powder is spray-deposited within the furrow to form a layer therein, the layer (i) comprising the metal, (ii) having a second grain size finer than the first grain size, and (iii) having a second crystalline microstructure more random than the first crystalline microstructure. Spray-depositing the powder within the furrow forms a distinct boundary line between the layer and the sputtering-target material.

In various embodiments, tubular sputtering targets are produced by forming a tubular billet at least by pressing molybdenum powder in a mold and sintering the pressed molybdenum powder, working the tubular billet to form a worked billet, and heat treating the worked billet.

In various embodiments, sputter-target formation includes application of a layer having an intermediate coefficient of thermal expansion between the backing plate and the target material.

Methods of forming sputtering targets

Molybdenum, sputtering targets and sintering characterized as having no or minimal texture banding or through thickness gradient. The molybdenum sputtering targets having a fine, uniform grain size as well as uniform texture, are high purity and can be micro-alloyed to improved performance. The sputtering targets can be round discs, square, rectangular or tubular and can be sputtered to form thin films on substrates. By using a segment-forming method, the size of the sputtering target can be up to 6 m&#xd7;5.5 m. The thin films can be used in electronic components such as Thin Film Transistor-Liquid Crystal Displays, Plasma Display Panels, Organic Light Emitting Diodes, Inorganic Light Emitting Diode Displays, Field Emitting Displays, solar cells, sensors, semiconductor devices, and gate device for CMOS (complementary metal oxide semiconductor) with tunable work functions.

Molybdenum tubular sputtering targets with uniform grain size and texture

Three dimensionally large metallic structures comprised of submicron grain sizes are produced by a process which includes directing a supersonic powder jet against a substrate such that the powder adheres to the substrate and to itself to form a dense cohesive deposit. The powder jet may be comprised of refractory metal powders. The powder may be deposited by a supersonic jet and may be extruded by Equi channel angular extrusion.

Low-energy method of manufacturing bulk metallic structures with submicron grain sizes

In various embodiments, large-area sputtering targets are formed by providing a plurality of sputtering targets each comprising a backing plate and a refractory metal layer disposed thereon, and spray depositing a refractory metal powder on an interface between the sputtering targets, the refractory metal powder consisting essentially of the same metal as each refractory metal layer, thereby joining the refractory metal layers of the sputtering targets.

Low-energy method for fabrication of large-area sputtering targets

Growing community of inventors

Framingham, MA, United States of America

Prabhat Kumar