Intel Corporation

Prabhakar Subrahmanyam

Ying-Feng Pang

Yi Xia

Victor Polyanko

Tong Wa Chao

Arun Krishnamoorthy

Rahima K Mohammed

Ridvan A Sahan

Mark Bianco

Yuehong Fan

Jun Zhang

Ming Zhang

Pooya Tadayon

Damion T Searls

Jun Lu

David Shia

Richard J Dischler

Barrett M Faneuf

Jin Yang

Casey R Winkel

Eric W Buddrius

Bijoyraj Sahu

Kenan Huseyin Arik

Catharina Biber

Michael Berktold

Kristin L Weldon

Carlos Alvizo Flores

Guoliang Ying

Liguang Du

Brendan T Pavelek

Yuyang Xia

Lianchang Du

Javier Avalos Garcia

Minh T D Le

Guangying Zhang

Luz Karine Sandoval Granados

Adriana Lopez Iniguez

Bergen Anderson

Peng Wei

John Raatz

Shengzhen Zhang

Yingqiong Bu

Yuan Li

Jeffrey Ryan Conner

Samer Melhem

Muhammad Ahmad

Xiang Que

Chuanlou Wang

Stephanie L Seaman

Techniques for heat exchanger networks are disclosed. In the illustrative embodiment, several heat exchangers and several components to be cooled are connected together in a network. The flow of liquid coolant to each component and heat exchanger can be individually controlled. If a particular component needs more or less cooling, the flow rate of coolant through that component can be controlled. If a first component needs more cooling and a second component can operate with less cooling, coolant may be rerouted from the first component to the second component. Thus, target temperature load balancing can be achieved for all the components of the system. If a heat exchanger is faulty, it can be isolated, and a backup heat exchanger can be brought online, making the system self-healing and fault-tolerant. The faulty heat exchanger can then be repaired or replaced while the rest of the system is operational.

Self-healing, target temperature load balancing, and related technologies for heat exchanger networks

An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.

Liquid cooling system leak detection improvements

Techniques for heat sinks and cold plates for compute systems are disclosed. In one embodiment, a heat sink includes two sub-heat sinks that are mechanically connected but thermally isolated. The two sub-heat sinks can independently cool different dies on the same integrated circuit component. In another embodiment, a system includes an integrated circuit component that is cooled by a first water block and a second water block. The first water block forms a loop with a gap in it, and the second water block has a pedestal that extends through the gap in the first water block to contact the integrated circuit component. The first water block and the second water block can independently cool different dies on the same integrated circuit component.

Technologies for isolated heat dissipating devices

An apparatus is described. The apparatus includes a liquid cooling system having multiple heat-exchangers and multiple valves. The multiple valves are to enable/disable participation of individual ones of the heat-exchangers within the liquid cooling system. The apparatus includes an information keeping device to store information that correlates a number of the multiple heat exchangers to be enabled to realize one or more semiconductor chips' target temperature for a power consumption of the one or more semiconductor chips for a plurality of combinations of target temperature and power consumption. The controller is coupled to the liquid cooling system and the information keeping device to dynamically determine during runtime of a system having the one or more semiconductor chips an appropriate number of the multiple heat exchangers to enable to realize a particular target temperature for the one or more semiconductor chips for a particular power consumption of the one or more semiconductor chips, and, update the information in the information keeping device with a new correlation that correlates the appropriate number with the particular target temperature and particular power consumption.

Self cooling adaptive flow branching heat exchanger system for cooling of one or more semiconductor chips

An apparatus is described. The apparatus includes an electronic system having a printed circuit board with electronic components mounted thereon. At least some of the electronic components are coupled to components of a liquid cooling system. The electronic system has a light source and a photosensitive element. The light source is to illuminate an illuminated region of the printed circuit board and/or at least one of the electronic components. The photosensitive element is to detect a change in reflection from the illuminated region in response to the presence of coolant that has leaked from the liquid cooling system within the illuminated region.

Optical leak detection of liquid cooling components within an electronic system

The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.

Thermal control for processor-based devices

Disclosed herein are integrated circuit (IC) packages with a heat generating electronic component and a fluid impingement cooling apparatus having a plurality of rotatable nozzles, as well as related devices and methods. In some embodiments, an IC device assembly may include a plurality of rotatable nozzles disposed in a nozzle plate, wherein the plurality of rotatable nozzles are rotatable individually; a microcontroller to identify a hotspot on a target surface of an IC device, wherein the hotspot has a temperature that is greater than a threshold temperature; and a motor coupled to the plurality of rotatable nozzles, wherein the motor causes one or more of the rotatable nozzles to rotate to impinge fluid on the hotspot.

Jet vectoring fluid impingement cooling using pivoting nozzles

Modular assemblies for thermal management are provided. Modularity permits or facilitates scalable thermal performance with respect to power dissipation demands. Modularity also permits retrofitting a deployed cooling system based at least on a current power dissipation requirement. In some embodiments, a modular assembly can be reversibly reconfigured in order to adjust cooling capacity and fulfill a defined power dissipation target. In some embodiments, a modular assembly can include a liquid-cooled pedestal and multiple liquid-cooled attachment members that can be reversibly coupled to or reversibly decoupled from the liquid-cooled pedestal based at least on a power dissipation condition and/or a change thereof of a dissipative electronic component. The reversible coupling and reversible decoupling of the attachment members can permit or otherwise facilitate reversibly adjusting the heat transfer between the modular assembly and the dissipative electronic component. Scalability of thermal performance of the modular assembly can be achieved, at least in part, by the addition of liquid-cooled attachment members.

Reconfigurable thermal control of high-powered integrated circuitry

Reconfigurable cooling assemblies for thermal management of integrated circuitry are provided. Such assemblies can be modular and can permit or otherwise facilitate scalable thermal performance with respect to power dissipation demands. In some embodiments, a reconfigurable modular cooling assembly can be reversibly configured to adjust reversibly the cooling capacity of the assembly for a defined power dissipation requirement. A form factor of a reconfigurable modular cooling assembly can be based at least on the defined power dissipation requirement. In some embodiments, a reconfigurable modular cooling assembly can include a pedestal member and multiple attachment members that can be reversibly coupled to or reversibly decoupled from the pedestal based at least on a power dissipation condition and/or a change thereof in a dissipative electronic component included in a semiconductor package. Scalability of thermal performance of the reconfigurable modular cooling assembly can be achieved, at least in part, by the addition of attachment members.

Reconfigurable cooling assembly for integrated circuitry

Growing community of inventors

San Jose, CA, United States of America

Prabhakar Subrahmanyam