Delco Electronics Corporation

Sarnoff Corporation

Intel Corporation

Other

Gm Global Technolgoy Operations, Inc.

Transpacific Infinity, LLC

Ferro Corporation

Ponnusamy Palanisamy

Srinivasan Sridharan

George E Sakoske

Dwadasi H Sarma

John A Hearn

Dwight L Schwarz

Walter Paul Sjursen

Bruce Alan Myers

David A Preves

Dennis Lee Matthies

John Gregory Aceti

Derek Dwayne Mahoney

John Michael Margicin

Frederick J Fritz

James R Demarco

Marvin Allan Leedom

Barry Jay Thaler

George Herbert Needham Riddle

John J Maloney

Peter L Madaffari

Joseph Michael Carpinelli

Christopher Just Poux

Ian Gregory Hill

Mark Stuart Hammond

Seth Trotz

Keith E Ewing

Umesh Kumar

Conghua Wang

William M Maki

Timur Akin

Anil K Kollipara

Richard Moroney

Bradford J Smith

An electronic device and coupled flexible circuit board and method of manufacturing. The electronic device is coupled to the flexible circuit board by a plurality of Z-interconnections. The electronic device includes a substrate with electronic components coupled to it. The substrate also has a plurality of device electrical contacts coupled to its back surface that are electrically coupled to the electronic components. The flexible circuit board includes a flexible substrate having a front surface and a back surface and a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate. The plurality of circuit board electrical contacts correspond to plurality of device electrical contacts. Each Z-interconnection is electrically and mechanically coupled to one device electrical contact and a corresponding circuit board electrical contact.

Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board

A display having improved thermal management and a method for producing the display are disclosed. The display includes a pixel structure adjacent a front panel with thermo-mechanical elements extending between a back panel and the pixel structure to dissipate heat generated by the pixel structure.

Thermal management in electronic displays

A woven article comprises a plurality of electrically insulating and/or electrically conductive yarn in the warp and a plurality of electrically insulating and/or electrically conductive yarn in the weft interwoven with the yarn in the warp. A functional yarn in the warp and/or the weft comprises an elongate substrate including at least one electrical conductor and at least one electronic device thereon, wherein the at least one electrical conductor provides directly and/or indirectly an electrical contact for connecting to the electronic device.

Woven electronic textile, yarn and article

A disposable-type hearing aid uses a relatively large single diaphragm or a large single diaphragm subdivided into a plurality of smaller active diaphragm areas obtained using a grate-like back support plate with ridges which contact and divide the diaphragm into the several smaller active diaphragm areas. The diaphragm and a backplate are enclosed in a metal housing and are disposed proximal and parallel to a shell-like hearing aid enclosure having sound inlets. The metal housing is closed at an end opposite the sound inlets by a printed circuit board (PCB) forming an acoustical seal for a back volume of the microphone. The PCB also carries substantially all the electronic components for the hearing aid thereon. The PCB has a ground plane in contact with the housing whereby the PCB also acts as an EMI shield. An electrical connection is formed in various ways between the back support plate and the PCB during assembly of the metal housing and components with the PCB. Mass production of disposable hearing aids with large diaphragms and relatively low noise levels is thus possible using this invention.

Hearing aid with large diaphragm microphone element including a printed circuit board

A display made from a display panel and a circuit board that are surface mounted to one another. The surface mount interconnections may be distributed across the display avoiding the need to situate the contacts around the periphery. Particularly, in large area displays made up of a plurality of abutting displays, making interconnections in the peripheral areas may be disadvantageous. The row and column contacts may be redundant to improve the yield and life time of the display. Contacts adjacent edges may be displaced into available space, spaced away from the edges.

Interconnecting large area display panels

An electronic device having an extensive narrow passageway may be effectively encapsulated by forming openings in one or more of the surfaces defining the encapsulation region. Encapsulation material may then be injected through these openings to fill a narrow, difficult to access region between two surfaces being encapsulated. In some cases, the encapsulant may be applied progressively, starting with a central port and applying the encapsulant in a radially expanding front through radially displaced ports.

Facilitating the spread of encapsulant between surfaces of electronic devices

A non-planar surface may be surface mounted to another surface using solder balls that may be modified to generate a planar surface for receiving the second surface. In one embodiment, the solder balls may be secured to an irregular surface and then scrapped to form a planar contacting surface. A second surface to be bonded to the first surface may then be attached to the planar contacting surface and the solder balls reflowed to create a surface mount.

Making interconnections to a non-flat surface

Solid oxide fuel cells made by coating a slurry of an electrolyte having a limited amount of organic material onto a carrier tape, depositing a one or two layer electrode material on the tape sufficient to support the electrolyte layer, removing the tape, screen printing a second electrode layer on the exposed surface of the electrolyte layer, and firing the layers at a temperature of 1100-1300&deg; C. The resultant fired fuel cell can be mounted on an interconnector comprising a base plate, grooves formed in one face of the base plate, a porous conductive ceramic contact layer between the base plate and an overlying blocking layer of a porous conductive layer to provide electrical contact between the base plate and the blocking layer, or an interconnector having a fired green tape stack having conductive via contacts and air and gas flow channels formed therein. A sealing glass bonds the overlying layers to the base plate. Such interconnector-mounted fuel cells can be stacked together to increase the voltage output of the fuel cells which can be used to power a load.

Solid oxide fuel cells and interconnectors

Surface mount technology may be utilized to join two surfaces together that may include relative surface irregularities. By varying the volume of surface mount material applied to electrically and physically join the two surfaces, surface-to-surface irregularities may be compensated for. Various techniques may be utilized to vary the volume of the interconnection material in a high speed fashion.

Surface mounting to an irregular surface

Growing community of inventors

Lansdale, PA, United States of America

Ponnusamy Palanisamy