Corning Incorporated

Polly Wanda Chu

Timothy Michael Gross

Adam James Ellison

Guangli Hu

Theresa Chang

Nicholas James Smith

Natesan Venkataraman

Patrick Joseph Cimo

Butchi Reddy Vaddi

Matthew John Dejneka

Michael Patrick Donovan

Lisa Anne Moore

Prakash Chandra Panda

Robert Lee Smith, Iii

Brian Paul Tyndell

Lisa Lynn Griesbach Hawkins

Louis Mattos, Jr

Anis Fadul

Kevin Joseph Yost

Dana Craig Bookbinder

George Edward Berkey

Daniel Warren Hawtof

Steven Roy Burdette

Adam J G Ellison

Daniel Raymond Sempolinski

Gautam Narendra Kudva

Yousef Kayed Qaroush

Gang Qi

A Joseph Antos

Michelle Diane Pierson-Stull

Sumalee Likitvanichkul

James Gerard Fagan

Jen-Chieh Lin

Carl Edgar Crossland

Joseph M Whalen

Pei-Lien Tseng

Shinu Baby

Douglas Edmon Goforth

Terry Lee Taft

Thomas William Hobbs

Robert Bumju Lee

Chouhwan Moon

John W Solosky

Michael John Walters

Timothy Paul Smith

Joseph Patrick Cimo

Jr Louis Mattos

Michael J Walters

Thomas W Hobbs

A glass element having a thickness from 25 μm to 125 μm, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress σI of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Bendable glass stack assemblies, articles and methods of making the same

A glass element having a thickness from 25 &#x3bc;m to 125 &#x3bc;m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress GI of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

A glass article having a first glass layer, a second glass layer disposed adjacent to the first glass layer, and an interface slidably coupling the first glass layer to the second glass layer. The interface has a thickness of from 2 nm to 500 nm. The glass article is characterized by: (a) an absence of failure when the article is held at a parallel plate separation distance of 10 mm for 60 minutes at 25&#xb0; C. and 50% relative humidity; (b) a puncture resistance of greater than about 6 kgf when the second glass layer is supported by (i) a 50 &#x3bc;m thick pressure-sensitive adhesive having an elastic modulus of less than 1 GPa and (ii) an approximately 100 &#x3bc;m thick polyethylene terephthalate layer having an elastic modulus of less than 10 GPa, and the first glass layer is loaded with a tungsten carbide ball having a 1 mm diameter.

Layered bendable puncture resistant glass article and method of making

A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress &#x3c3;of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress &#x3c3;at the first primary surface in tension, &#x3c3;+&#x3c3;&#x3c;400 MPa (in tension). Further, the cover element can withstand a pen drop height of at least 1.5 times that of a control pen drop height of the cover element without the layer according to a Drop Test 1.

Foldable electronic device assemblies and cover elements for the same

A glass element having a thickness from 25 &#x3bc;m to 125 &#x3bc;m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress &#x3c3;I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

A glass roof shingle includes a shingle cover layer made of a glass. A shingle base layer is disposed underneath the shingle cover layer. The shingle base layer and shingle cover layer define a cavity. A seal area formed between the shingle base layer and shingle cover layer and around the cavity controls ingress of moisture into the cavity. A photovoltaic module may be disposed within the cavity.

Glass roof shingle

A glass element having a thickness from 25 &#x3bc;m to 125 &#x3bc;m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress &#x3c3;I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, with the center of curvature on the side of the second primary surface so as to induce a bending stress &#x3c3;B at the first primary surface, &#x3c3;I+&#x3c3;B&#x3c;0. Still further, the glass element has a puncture resistance of &#x2267;1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

A glass element having a thickness from 25 &#x3bc;m to 125 &#x3bc;m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress &#x3c3;I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is held at a bend radius from about 1 mm to about 20 mm for at least 60 minutes at about 25&#xb0; C. and about 50% relative humidity. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

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Painted Post, NY, United States of America

Polly Wanda Chu