Freescale Semiconductor,inc.

Nxp Usa, Inc.

Poh Leng Eu

Kai Yun Yow

Boon Yew Low

Lan Chu Tan

Wai Keong Wong

Wai Yew Lo

Meng Kong Lye

You Ge

Cheng Qiang Cui

Chin Teck Siong

Penglin Mei

A packaged semiconductor device includes a substrate having input/output (I/O) pads, a semiconductor die attached to the substrate and electrically connected to the substrate with bond wires. A bond-wire reinforcement structure is formed over the bond wires before the assembly is covered with a molding compound. The bond-wire reinforcement structure prevents wire sweep during molding and protects the wires from shorting with other wires. In one embodiment, the bond-wire reinforcement structure is formed with a fiberglass and liquid epoxy mixture.

Semiconductor device with bond wire reinforcement structure

A patterned, non-conductive substrate for an integrated circuit (IC) package has a die side configured to receive a die and a lead side opposite the die side. A pattern formed in the substrate defines openings (e.g., holes, steps, grooves, and/or cavities) that extend between the die side and the lead side of the substrate. In the IC package, the openings are filled with conductive material (e.g., solder) that supports electrical connections between bond pads on the die and leads formed from the conductive material. The substrate can be used to form a relatively inexpensive, quad flat no-lead (QFN) IC package without using a metal lead frame and without bond wires.

IC device having patterned, non-conductive substrate

A semiconductor device has a die mounted on a die paddle that is elevated above and thermally connected via tie bars to a heat sink structure. Heat generated by the die flows from the die to the die paddle to the tie bars to the heat sink structure and then to either the external environment or to an external heat sink. By elevating the die/paddle sub-assembly above the heat sink structure, the packaged device is less susceptible to delamination between the die and die attach adhesive and/or the die attach adhesive and the die paddle. An optional heat sink ring can surround the die paddle.

Semiconductor package with stress relief and heat spreader

A packaged semiconductor device has an integrated circuit (IC) die and a heat spreader. The heat spreader has a first portion with holes formed entirely therethrough. The first portion is attached to the die using thermally-conductive adhesive that fills the holes. The holes enable the heat spreader to be attached to the die without placing excess pressure on the IC die that could cause the die to crack.

Semiconductor device with die attached heat spreader

A semiconductor package has a substrate with a solder mask layer, and upper and lower surfaces. Conductive traces and electrical contacts are formed on the substrate, and vias are formed in the substrate to electrically connect the conductive traces and electrical contacts. A semiconductor die is attached on the upper surface of the substrate. A mold cap is formed on the upper surface of the substrate and covers the die and the conductive traces. The mold cap includes a mold body having clipped corners and extensions that extend from each of the clipped corners. The extensions and clipped corners help prevent package cracking.

Mold cap for semiconductor device

A packaged semiconductor device with a cavity formed by a cover or lid mounted to a substrate. The lid covers one or more semiconductor sensor dies mounted on the substrate. The dies are coated with a gel or spray on coating, and the lid is encapsulated with a mold compound. A hole or passage may be formed through the cover and mold compound to expose the sensor dies to selected environmental conditions.

Semiconductor sensor device with over-molded lid

A method of assembling a pressure sensor device includes providing a substrate having a plurality of substrate connection pads. A pressure sensor die is attached to a first major surface of the substrate and bond pads of the pressure sensor die are electrically connected to the respective substrate connection pads. A retractable cavity pin is placed on the first major surface of the substrate such that the cavity pin covers the pressure sensor die and the electrical connections to the die. A molding compound is then dispensed onto the first major surface of the substrate such that the molding compound surrounds the pressure sensor die and the cavity pin. The cavity pin is retracted such that a cavity is formed around the pressure sensor die and a gel material is dispensed within the cavity such that the gel material fills the cavity and covers the pressure sensor die.

Method of assembling pressure sensor device

A mold () including a first mold part () and a second mold part () define a mold cavity () therebetween. A gate () is formed in at least one of the first and second mold parts () and () such that the gate () communicates with the mold cavity (). A vent () having a constricted portion () is arranged to communicate with the mold cavity (). A substrate () including a base substrate () and an electrically conductive pattern () and () formed on the base substrate () may be received in the mold (). A solder resist layer () is formed on the base substrate () and a portion of the electrically conductive pattern (). A plurality of grooves () and () is formed in a staggered arrangement around a periphery of a molding area () on the substrate ().

Mold and substrate for use with mold

A self monitoring vehicle braking system includes multiple sensors that gather data associated with the braking system. The data includes wheel speed, road inclination, moisture associated with a surface of the braking system, and audio associated with the road. A processor receives the data from the sensors and processes the data to determine whether a condition of the braking system falls within defined limits and provides to the driver of the vehicle an indication of the braking system condition.

Self monitoring braking system for vehicles

A method of attaching a solder ball to a bonding pad includes disposing flux on the bonding pad, attaching a conductive metal ring to the pad using the flux, and placing the solder ball in the ring. A reflow operation is performed that secures the ring to the pad and melts the solder ball into and around the ring. A solder joint is formed between solder ball and the pad, with the ring secured within the ball. Use of the ring allows for higher stand-off height to be achieved with similar solder ball size, without having to use bigger ball size as in the conventional method, which causes solder ball bridging. With higher stand-off height, better board level reliability performance can be obtained.

Solder ball attachment ring and method of use

A semiconductor substrate includes a substrate layer and a circuit film formed over the substrate layer. One or more openings are formed in the circuit film and the substrate layer. Conductive plates are formed over the circuit film at the peripheries of the openings. A semiconductor die is attached to the circuit film, below the openings with an adhesive material. A conductive material is disposed in the openings to electrically connect the semiconductor die to the conductive plates.

Semiconductor substrate and method of connecting semiconductor die to substrate

An integrated circuit package includes an integrated circuit diehaving a plurality of optical elementssensitive to and/or capable of generating light, whereby data communication to circuitry of the integrated circuit die can be effected using a data channels implemented using the plurality of elements. The data channels are along optical pathways provided by an adapter unitmounted on a PCBThe adapter unitforms the optical pathways between optical fibersand the respective optical elementThus, there is no requirement to implement expensive wire-bonding as part of the packaging process.

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Petaling Jaya, Malaysia

Poh Leng Eu