Asustek Computer Inc.

Industrial Technology Research Institute

Po-Yao Lin

Chao-Tsai Chung

Cheng-Chen Cheng

Ching-Bai Hwang

A heat dissipation module. The heat dissipation module comprises a cover, a fan, a base and a plurality of fin assemblies. The fan is disposed on the cover. The base is disposed underneath the fan and has a protruding portion. The protruding portion has two slant surfaces and a top end. The protruding portion gradually tapers toward the fan. The plurality of fin assemblies are disposed on the slant surfaces of the protruding portion of the base.

Heat dissipation module

A side-exhaust heat dissipation module for cooling an electronic device. The side-exhaust heat dissipation module comprises a base, a fan, a fin assembly and an airflow guiding cover. The fan is disposed on one side of the base. The fin assembly is disposed on the base and composed of a plurality of parallel fins. The fin assembly has a concave end spaced from the fan by a predetermined distance. The airflow guiding cover is disposed on the fin assembly. The airflow guiding cover is gradually expanded and extended from the fan to cover the fin assembly.

Side exhaust heat dissipation module

An integrated circuit package has a printed circuit board, a die mounted on the printed circuit board, and a heat spreader attached to the printed circuit board to cover the die and contact with the backside of the die. The heat spreader is formed by a piece body and a plurality of supporting leads extended downward from the periphery of the piece body. The supporting leads of the heat spreader are attached to the printed circuit board by surface mounting technology. The piece body of the heat spreader abuts on the backside of the die so that heat from the die can be conducted both upward to the outer environment and downward to the printed circuit board through the heat spreader, thereby enhancing the heat dissipation efficiency.

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Taipei, Taiwan

Po-Yao Lin