United Microelectronics Corp.

Po-Ya Lai

Tien-Hao Tang

Kuan-Cheng Su

Chung-Yu Huang

Ping-Jui Chen

Shih-Che Yen

An ESD protection semiconductor device includes a substrate. A gate set disposed on the substrate. A plurality of source fins and a plurality of drain fins having a first conductivity type are disposed in the substrate respectively at two sides of the gate set. A first doped fin is disposed in the substrate and positioned in between the source fins and spaced apart from the source fins. The first doped fin comprises a second conductivity type that is complementary to the first conductivity type. A second doped fin is formed in one of the drain fins and isolated from the one of the drain fins by an isolation structure. The second doped fin is electrically connected to the first doped fin.

Electrostatic discharge protection semiconductor device

An ESD protection semiconductor device is disclosed. The ESD protection semiconductor device includes a substrate and a gate set disposed on the substrate. A plurality of source fins and a plurality of drain fins are formed in the substrate respectively at two sides of the gate set. At least a first doped fin is formed in the substrate at one side of the gate set the same as the source fins. A plurality of isolation structures are formed in one of the drain fins to define at least a second doped fin in the one of the drain fins. The source fins and the drain fins are of a first conductivity type. The first doped fin is of a second conductivity type that is complementary to the first conductivity type. The first doped fin and the second doped fin are electrically connected to each other.

An ESD protection semiconductor device includes a substrate, a gate set formed on the substrate, a source region and a drain region formed in the substrate respectively at two sides of the gate set, and at least a doped region formed in the source region. The source region and the drain region include a first conductivity type, and the doped region includes a second conductivity type complementary to the first conductivity type. The doped region is electrically connected to a ground potential.

An ESD protection semiconductor device includes a substrate, a gate set formed on the substrate, a source region and a drain region formed in the substrate respectively at two sides of the gate set, at least a first doped region formed in the source region, and at least a second doped region formed in the drain region. The source region, the drain region and the second doped region include a first conductivity type, and the first doped region includes a second conductivity type. The first conductivity type and the second conductivity type are complementary to each other. The second doped region is electrically connected to the first doped region. The gate set includes at least a first gate structure, a second gate structure, and a third gate structure.

An ESD protection device includes a semiconductor substrate, a well, a gate structure, a first source/drain region, a second source/drain region, a first doped region, and a second doped region. The well is disposed in the semiconductor substrate. The gate structure is disposed on the well. The first source/drain region and the second source/drain region are disposed in the well and disposed at two opposite sides of the gate structure respectively. The first doped region is disposed in the first source/drain region. The second doped region is disposed in the second source/drain region. A conductivity type of the first doped region is complementary to that of the first source/drain region. A conductivity type of the second doped region is complementary to that of the second source/drain region. A conductivity type of the well is complementary to that of the first source/drain region and the second source/drain region.

Electrostatic discharge protection device and manufacturing method thereof

An electrostatic discharge (ESD) unit is described, including a first device, and a second device coupled to the first device in parallel. In an ESD event, the first device is turned on before the second device is turned on. The second device may be turned on by the turned-on first device to form an ESD path in the ESD event.

ESD unit

An ESD protection semiconductor device includes a substrate, a gate set formed on the substrate, a source region and a drain region formed in the substrate respectively at two sides of the gate set, and at least a first doped region formed in the drain region. The source region and the drain region include a first conductivity type, and the first doped region includes a second conductivity type. The first conductivity type and the second conductivity type are complementary to each other. The first doped region is electrically connected to a ground potential.

An ESD protection semiconductor device includes a substrate, a gate set formed on the substrate, a source region and a drain region formed in the substrate respectively at two sides of the gate set, at least a first doped region formed in the source region, and at least a second doped region formed in the drain region. The source region, the drain region and the second doped region include a first conductivity type, and the first doped region includes a second conductivity type. The first conductivity type and the second conductivity type are complementary to each other. The second doped region is electrically connected to the first doped region.

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Changhua County, Taiwan

Po-Ya Lai