Synopsys, Inc.

Biogend Therapeutics Co., Ltd.

National Taiwan University

Tslc Corporation

Memetics Technology Co. Ltd.

Po-Wei Lee

Yao-Wen Chang

Hsien-Shih Chiu

Tien-Chang Hsu

I-Jye Lin

Chen-Feng Chang

Chin-Fang Shen

Chun-Wei Lin

Shey-Shi Lu

Yu-Che Yang

Hung-Wei Chiu

Chao-Ping Chen

C Chu

Chun Nan Chen

Ting-Fan Yang

Tzu-Han Lin

Shih-Ting Hsu

Medical implant set

Combined scraping and collecting device

A light emitting device includes a circuitry substrate and multiple light emitting diodes (LEDs) bonded to the circuitry substrate in a spaced array. The light emitting device also includes a continuous and substantially flat wavelength conversion member covering the light emitting diodes (LEDs) configured to convert the electromagnetic radiation emitted by the light emitting diodes (LEDs) into another wavelength range. The light emitting device also includes a planarized layer configured to support the wavelength conversion member on the circuitry substrate. The light emitting device can also include a light shaper on the wavelength conversion member configured to form emitting windows for the electromagnetic radiation transmitted through the wavelength conversion member forming an output light beam having a desired emitting window size, shape, and edge and to block and minimize scattered electromagnetic radiation from the wavelength conversion layer.

Light emitting device

Disclosed herein are rouging methods and devices for a flip-chip package. The flip chip includes several outer pads and several inner pads. The routing method includes: setting an outer sequence based on the arrangement order of the outer pads; setting several inner sequences based on the connection relationships between inner pads and the outer pads; calculating the longest common subsequence of each inner sequence and the outer sequence, defining the connection relationships between the inner pads and the outer pads corresponding to the longest common subsequence as direct connections, and defining the connection relationships between the inner pads and the outer pads that do not correspond to the longest common subsequence as detour connections; establishing the routing scheme of the flip chip based on the connection relationships between the inner pads and the outer pads.

Routing method for flip chip package and apparatus using the same

The designing method and circuits for a multi-band electronic circuit having at least one transistor have been proposed. The proposed method includes steps of: (a) changing the capacitance between the input terminal and the output terminal of the transistor of the circuit, and (b) obtaining the resonant frequency of the circuit in response to the changed capacitance for switching among multiple bands. The designing method and circuits for a multi-band amplifier, which includes at least one transistor having an input terminal and an inductor electrically connected to the input terminal of the transistor, have been proposed too. The designing method for a multi-band amplifier includes steps of: changing the bias of the transistor, and switching the resonant frequency of the input impedance of the transistor and the inductor in response to the changed bias for switching among multiple bands.

Designing methods and circuits for multi-band electronic circuits

Growing community of inventors

Taipei, Taiwan

Po-Wei Lee