Taiwan Semiconductor Manufacturing Comp. Ltd.

Industrial Technology Research Institute

Po-Ting Yeh

Kai-Cheung Juang

Wen-Yun Wang

Yuan-Tai Chang

Yen-Chun Chen

Chang-Jen Chen

A method for calibrating the alignment of a wafer is provided. A plurality of alignment position deviation (APD) simulation results are obtained form a plurality of mark profiles. An alignment analysis is performed on a mark region of the wafer with a light beam. A measured APD of the mark region of the wafer is obtained in response to the light beam. The measured APD is compared with the APD simulation results to obtain alignment calibration data. An exposure process is performed on the wafer with a mask according to the alignment calibration data.

Method for calibrating alignment of wafer and lithography system

A method and a system for controlling a rectifier can obtain a predicted switching interval. The method includes steps of: receiving frequency information and line information of a power generator, the line information including a switching point where a voltage or current crosses zero and a switching interval based on the frequency information; obtaining a predicted switching interval according to the frequency information and the line information, and obtaining a feedback signal according to two terminals of at least one component of the rectifier; and switching a switching signal of the rectifier within the predicted switching interval according to the feedback signal.

Predictive switching control for an active rectifier

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Hsinchu, Taiwan

Po-Ting Yeh