Advanced Micro Devices Corporation

Sandisk Technologies Inc.

Sandisk Corporation

Other

Po-Shen Lai

Autumn Jane Niu

Jerry Chun-Jen Kuo

Paul Paternoster

Paul A Lassa

John Mingyung Chiang

Yuheng Zhang

Steve Chi

Yongliang Wang

Hao Su

Daniel P Nguyen

Vaibhavi Sabharanjak

Yan Li

Ching Yu

Toru Miwa

Tz-Yi Liu

Ekram Bhuiyan

Ian Lam

Jenny Liu Fischer

Hiroyuki Mizukoshi

Vijay Chinchole

Henry Zhang

Yibo Yin

Chih-Siung Wu

Lakhdar Iguelmamene

Ralph Heron

Vincent Anthony Condito

Jayesh Pakhale

Spyridon Georgakis

Jerry Chun-Ken Kuo

Ekram Hossain Bhuiyan

Steve X Chi

An apparatus including a memory structure comprising non-volatile memory cells and a microcontroller. The microcontroller is configured to output Core-Timing-Control (CTC) signals. The CTC signals are used to control voltages that are applied in the memory structure. For example, CTC signals may be used to control the timing of voltages applied to word lines, bit lines, select lines, and other elements or control lines in the memory core. The microcontroller is configured to output CTC signals having many different variations under various modes/parameter conditions. The apparatus may include storage containing reaction data according to dynamic conditions. The microcontroller may be configured to lookup or compute the CTC signals based on the dynamic conditions and the reaction data. Various data storage formats are disclosed, which can be used to efficiently store many varieties of data with minimum usage of memory.

Efficient control of memory core circuits

Apparatuses, systems, methods, and computer program products are disclosed for a multicore on-die memory controller. An integrated circuit device includes an array of non-volatile memory cells and a microcontroller unit. A microcontroller unit includes a plurality of processing units. Different processing units perform different categories of tasks in parallel for an array of non-volatile memory cells.

Multicore on-die memory microcontroller

A multi-interface integrated circuit in which, during the chip's lifetime in use, only one interface is active at a time. However, special test logic powers up all of the on-chip interface modules at once, so that a complete test cycle can be performed. All of the interfaces are exercised in one test program. Since some pads are inactive in some interface modes, mask bits are used to select which pads are monitored during which test cycles.

Exclusive-option chips and methods with all-options-active test mode

An integrated circuit (IC) having a selectively-designated electromagnetic compatibility (EMC) performance characteristic. The IC includes an IC die having an input or output (I/O) node. A first I/O cell of a first type associated with the I/O node provides a first EMC performance characteristic, and a second I/O cell of a second type associated with the I/O node provides a second EMC performance characteristic different from the first EMC performance characteristic. A first bonding pad is electrically coupled with the first I/O cell, and a second bonding pad is electrically coupled with the second I/O cell. The IC die can be packaged into a packaged IC having an I/O pin corresponding to the I/O node. The I/O pin is wired to one of either the first bonding pad or the second bonding pad, but not to the other, such that a pinout for the I/O node is preferentially provided having one of either the first EMC performance characteristic or the second EMC performance characteristic.

Integrated circuit and manufacturing process facilitating selective configuration for electromagnetic compatibility

A plurality of separately powered data interface circuits, a controller circuit, and power switch circuits that collectively enable a supply of power to only one of the data interface circuits and disable the supply of power to the other data interface circuits. Alternatively, the separately powered circuits need not be data interface circuits.

Selectively powered data interfaces

Methods and systems for forming a variety of integrated circuits, having quite different interfaces and packages, from a single manufactured die. Preferably the die has bond pads for at least a first mode of operation positioned along only two of its four sides, and these bond pads are sufficient to construct a multi-chip module in which the die is functional in the first mode of operation. Many of the pads on these two sides are duplicated on third and/or fourth sides, except that power management circuitry prevents wasteful capacitive current onto whichever of the duplicated pads is not connected out. Optionally the third and/or fourth sides can be used for connections needed for a mode which is not available with two sides only.

Optionally bonding either two sides or more sides of integrated circuits

An electronic product includes an application specific semiconductor chip (ASIC) device which includes in its circuitry both a linear regulator module configured to be coupled to an optional external capacitance and a capless regulator module configured to be coupled to internal capacitance of the electronic product. Control logic of the ASIC device is responsive to a regulator selection signal for selecting one of the linear regulator module and the capless regulator module for use in powering the ASIC device. The control logic may select the linear regulator module for certain times of operation and the capless regulator module for other times of operation.

Multi-regulator power delivery system for ASIC cores

A method for operating an electronic product having an application specific semiconductor circuit (ASIC) including in its circuitry both a linear regulator module for use with an optional external capacitance and a capless regulator module coupled to internal capacitance of the product selects a low-power sub-module or high-power sub-module of the capless regulator module for use in a power-up phase of the ASIC. Control logic of the ASIC determines if an external capacitance is present. If so, then the high-power capless sub-module is used during a power-up phase of the ASIC; if not only the low-power capless sub-module is used during the power-up phase of the ASIC. After power-up of the ASIC, the control logic may select the linear regulator module for certain times of operation and the capless regulator module for other times of operation or it may select one or the other for all times of post-power-up operation.

Self-configurable multi-regulator ASIC core power delivery

An integrated circuit (IC) includes an output driver circuit portion that is electrically configurable, via a configuration input, to operate in either a first mode or a second mode corresponding to an indication of a condition of the IC, such as a supply voltage indication, the first mode and the second mode having different drive characteristics. A configuration interface circuit portion as part of the improved IC is adapted to selectively override the configuration input to configure operation of the output driver circuit portion in either the first mode or the second mode based on a drive strength control input, regardless of the condition of the IC.

Extending drive capability in integrated circuits utilizing programmable-voltage output circuits

A network interface device includes a random access memory used as a transmit and receive buffer for transmission and reception of data between a host computer bus and a packet switched network. The network interface device includes a memory controller that determines whether a complete frame is stored in the random access memory and also determines an amount of data available to be read from the oldest received frame. A host CPU is able to access this information and determine whether to read the data or read the data at a later time.

Apparatus and method in a network interface device for determining data availability in a random access memory

A network switch in a packet switched network includes a plurality of network switch ports, each configured for sending and receiving data packets between a medium interface and the network switch. The network switch port includes an IEEE 802.3 compliant transmit state machine and receive state machine configured for transmitting and receiving network data to and from a medium interface, such as a reduced medium independent interface, respectively. The network switch port also includes a memory management unit configured for selectively transferring the network data between the transmit and receive state machines and a random access transmit buffer and a random access receive buffer, respectively. The transmit state machine outputs a flush transmit buffer signal to the transmit memory management unit in response to a detected error in transmitting the transmit data. The transmit memory management unit, in response to the flush transmit buffer signal, sets an incremented transmit buffer pointer value to a buffer pointer value corresponding to a next transmit data stored in the transmit buffer.

Architecture and method for flushing non-transmitted portions of a data frame from a transmitted FIFO buffer

A network interface device includes a random access memory used as a transmit and receive buffer for transmission and reception of data between a host computer bus and a packet switched network. The network interface device includes a read controller and read offset register that stores read pointer information. The host CPU programs the read offset register to any particular value so that the read controller will read data from a desired starting point. In this manner, the host CPU is able to skip parts of a frame stored in the random access memory.

Network interface device for accessing data stored in buffer memory locations defined by programmable read pointer information

A network interface device includes a random access memory used as a transmit and receive buffer for transmission and reception of data frames between a host computer bus and a packet switched network. The network interface device includes read and write controllers for each of the transmit and receive buffers, where each write controller operates in a clock domain separate from the corresponding read controller. Read and write counters are each implemented as gray code counters that increment a corresponding pointer value by changing a single bit. A synchronization circuit selectively sets a full or empty flag based on an asynchronous comparison of the read and write pointer values. Use of gray code counters for the read pointer value and write pointer value ensures accurate comparisons in a multi-clock environment.

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San Jose, CA, United States of America

Po-Shen Lai