Interface Optoelectronics (shenzhen) Co., Ltd.

General Interface Solution Limited

Interface Technology (chengdu) Co., Ltd.

Shenzhen China Star Optoelectronics Technology Co., Ltd.

Po-Lin Chen

Yen-Heng Huang

Yue-Feng Yang

Hsuan-Man Chang

Ju-Xiang Liu

Jhe-Wei Zeng

Hung-Chieh Chin

Gang Wu

Hung Chien Lee

Yu-Lien Chou

Yueh-Feng Yang

Chung-Hung Lin

Ming-Yang Li

Feng Ju Li

Cheng-Lung Chiang

Mei-Hua Chou

Min-Hui Yin

Fa-Lin Liu

Ya-Yin Cheng

Dong-Sheng Xie

Chu-Jung Lin

Chia-Chi Yeh

A curved display and a method for binding a cover glass of the curved display are provided. The curved display includes a display module, a frame body and a cover glass. The frame body has a first flat surface and a second flat surface opposite to the first flat surface, in which the first flat surface is adhered to the display module. The cover glass has a binding flat surface and an application surface opposite to the binding flat surface, in which the binding flat surface is adhered to the second flat surface of the frame body, and the application surface is a surface with curvature. The second flat surface of the frame body is set with a first alignment mark, and the binding flat surface of the cover glass is set with a second alignment mark, and the first alignment mark corresponds to the second alignment mark.

Curved display and method for binding cover glass of curved display

An improved insulation protection structure comprises a sensor film, a chip outline, a protective film, and an insulating cement layer. The chip outline is on the sensor film, the protective film is on the chip outline, the insulating cement layer is between the chip outline and the protective film. The insulating cement layer comprises at least one surface facing inward the chip outline, retracted toward the direction of the chip outline and forms a retracted region along at least one side of the sensor film. Area of the proposed retracted region is preferably no more than 20% of that of the total insulating cement layer, and the conventional issues such as sulphide corrosion are solved. The proposed insulating cement layer can be cured merely at room temperature, and widely used for adhesive materials including both a gel and film, thus characterized by wider application range and better industrial applicability.

Insulation protection structure

A touch panel includes a touch sensing layer, a flexible circuit board and an anisotropic conductive film. The touch sensing layer includes sensing pads and a reserved room, and the reserved room is arranged outside the sensing pads. The flexible circuit board includes conductive pads, the outermost conductive pad is provided with a virtual pattern, and the position of the virtual pattern corresponds to the position of the reserved room. The anisotropic conductive film is arranged between the touch sensing layer and the flexible circuit board, and the sensing pads are respectively electrically connected to the conductive pads through the anisotropic conductive film.

Touch panel

A touch module includes a substrate and a touch electrode layer. The touch electrode layer is disposed on the substrate. The touch electrode layer includes a plurality of main mesh patterns and a plurality of dummy mesh patterns. The dummy mesh patterns of the touch electrode layer each have a plurality of breakpoints.

Touch module

A touch panel includes a light-transmissive cover, a display module, and a touch sensing layer. The display module is disposed on the light-transmissive cover. The touch sensing layer is disposed between the light-transmissive cover and the display module, and has a first side and a second side opposite to the first side. The first side has a first folding region, and the second side has a second folding region. When the first side and the second side of the touch sensing layer are unfolded, the first folding region and the second folding region extend outward from two opposite edges of the light-transmissive cover. When the first side and the second side of the touch sensing layer are folded, the first folding region and the second folding region are located on the display module.

Touch sensor and touch panel having the same

The present disclosure provides a touch panel structure, which includes a conductive channel region and a second dummy metal pattern. The conductive channel region includes a metal mesh and a first dummy metal pattern. The metal mesh is a conductive channel. The first dummy metal pattern is intersecting the metal mesh and has at least one breakpoint at every point of intersection with the metal mesh. The metal mesh is separated from the first dummy metal pattern to be insulated from the first dummy metal pattern at the at least one breakpoint. The second dummy metal pattern is disposed on the both sides of the conductive channel region.

Touch panel structure

A touch sensing module includes a substrate, sensing electrodes, and a covering layer. The sensing electrodes are disposed on a surface of the substrate. Each of the sensing electrodes has a first end and a second end opposite to the first end. The second end is adopted to be electrically connected with an external circuit. The covering layer is disposed on a side of the sensing electrodes distal from the substrate, and covers the sensing electrodes. The covering layer has openings. The first ends of the sensing electrodes are exposed within the openings respectively.

Touch sensing module

A touch display panel is provided. The touch display panel includes a cover and a touch sensing layer. The cover has a touch-sensing section, a first bending section, and a first side section. The first side section and the touch-sensing section are not coplanar and the first bending section is located between the touch-sensing section and the first side section. The touch sensing layer is located under the cover and includes a first metal mesh layer and a second metal mesh layer. Only one of the first metal mesh layer and the second metal mesh layer is located under the first bending section.

Touch display panel

A touch module for preventing separation of silver paste between laser etching traces, comprises a substrate, a plurality of touch electrodes, and a silver paste. A side of the touch electrode has a pin area. The pin area contains a plurality of perforations. The silver paste is coated on the substrate and the pin area for connecting electrical circuitry between the pin area and the connection line area. Wherein the silver paste on the pin area flows into the perforations and connects to the substrate. Therefore separation of the silver paste on the pin area and touch electrodes will less likely occur due to minor coating errors. The present invention also provides a manufacturing method of a touch module that prevents separation of the silver paste between laser etching traces.

Touch module for preventing separation of silver paste between laser etching traces and method of manufacture

A TFT array manufacturing method is disclosed herein and includes steps: forming a first metal layer on a substrate; depositing a first insulating layer to cover the first metal layer; forming an oxide semiconductor layer on the first insulating layer in a TFT area; forming a second insulating layer on the first insulating layer and the oxide semiconductor layer; etching the second insulating layer in the TFT area to expose the oxide semiconductor layer and etching the second insulating layer and the first insulating layer in a signal wire area simultaneously to expose the first metal layer; and forming a second metal layer on the second insulating layer of the TFT area, and the second metal layer being connected the oxide semiconductor layer, and forming the second metal layer on the first metal layer of the signal wire area to contact the first metal, layer.

Thin film transistor array manufacturing method

The present invention discloses a manufacturing method for a switch and an array substrate. The method comprises: firstly, forming sequentially a first metal layer, an insulating layer, a semiconductor layer, an ohmic contact layer, a second metal layer, a third metal layer and a photoresist layer on a base substrate; after patterning the photoresist layer, etching the third metal layer and the second metal layer to form the input electrode and the output electrode of the switch; using a stripper comprising at least 30% by weight of amine in order to remove the photoresist layer and the residual second metal layer; and finally, etching the ohmic contact layer. Through the above steps, the present invention can avoid the electrical abnormality of the switch and increase process yield of the array substrate.

Growing community of inventors

Guangdong, China

Po-Lin Chen