Century Technology (shenzhen) Corporation Limited

Po-Liang Chen

Yung-Fu Lin

Yasunori Shimada

Hirohisa Tanaka

Jung-Hua Lee

Huihsien Tien

A method for transferring light emitting elements during manufacture of a display panel includes providing light emitting elements; providing a first electromagnetic plate defining adsorption positions; providing a receiving substrate defining receiving areas; energizing the first electromagnetic plate to magnetically adsorb one of the light emitting elements at each adsorption position; facing the first electromagnetic plate to the receiving substrate; and transferring the light emitting elements to one corresponding receiving area of the receiving substrate.

Display panel and substrate with an electromagnetic circuit layer

A substrate and a display panel using the substrate are disclosed. The substrate includes a base layer; a magnetic material layer on a side of the base layer; and a thin film transistor (TFT) array layer on a side of the magnetic material layer away from the base layer.

Method for transferring light emitting elements, display panel, method for making display panel, and substrate

A transferring method includes providing an adsorption device, using the adsorption device to attract and hold a plurality of light emitting diodes (LEDs), providing a target substrate with a plurality of spots of anisotropic conductive adhesive on a surface of the target substrate; moving the adsorption device or the target substrate wherein each of the plurality of LEDs adsorbed by the adsorption device becomes in contact with one of the plurality of spots of anisotropic conductive adhesive; and curing the plurality of spots of anisotropic conductive adhesive on the target substrate and moving away the adsorption device.

Adsorption device, transferring system having same, and transferring method using same

A method for making an adsorption device includes: providing and etching a substrate to form a plurality of receiving grooves spaced apart from each other; forming a magnetic film in each of the plurality of receiving grooves; and forming a magnet in each of the plurality of receiving grooves. Each receiving groove includes a bottom wall and a side wall coupling the bottom wall. The magnetic film covers the bottom wall and the side wall of each of receiving groove.

Method for making adsorption device

A device for collecting and transferring light emitting elements of microscale size includes a non-magnetic plate, a plurality of magnetic probes, and a magnetic plate. The non-magnetic plate defines through holes. Each of the probes is fixed in one through holes. The magnetic plate is on a surface of the non-magnetic plate and closes one opening of each of the through holes. The magnetic plate generates a magnetic field, so that each of the probes magnetically attracts one light emitting element. A method for making the transfer device and a method for transferring light emitting elements using the transfer device are also disclosed.

Device for transfer of light emitting elements, method for transferring light emitting elements, and method of manufacturing the transfer device

An adsorption device includes a substrate and a magnetic film on a surface of the substrate. The substrate has magnetic properties and is capable of generating magnetic field. The magnetic film partially covers the surface. The magnetic film generates a magnetic field having a direction that is opposite to a direction of the magnetic field generated by the substrate. Portions of the surface of the substrate not covered by the magnetic film form positions to attract and adsorb target objects, and other portion of the surface of the substrate covered by the magnetic film is not able to attract any target object.

A device to attract and hold microscopic items such as micro LEDs magnetically rather than by static electricity includes a substrate and a plurality of magnetic units on a surface of the substrate. The magnetic units are spaced apart from each other and are constrained in the size and direction of their individual magnetic fields. Each of the magnetic units includes a magnet and a cladding layer partially covering the magnet. The cladding layer is made of a magnetic material. A side of the magnet away from the substrate is exposed from the cladding layer to attract and hold one micro LED.

Adsorption device, method for making same, and transferring system having same

Method for transferring light emitting elements, and method for making display panel

An adsorption device includes a magnetic plate and a limiting layer. A surface of the magnetic plate includes a first region and a plurality of second regions spaced apart from each other. The first region and each second region do not overlap with each other. The first region forms a magnetic pole of the magnetic plate, and each second region forms the opposite magnetic pole of the magnetic plate. The limiting layer covers the first region. Each second region is exposed to the limiting layer and configured for adsorbing a small-scale LED as a target object.

Adsorption device comprising a magnetic plate having opposite magnetic poles, transferring system having same

An adsorption device includes a substrate, a plurality of magnetic films, and a plurality of magnets. The substrate defines a plurality of receiving grooves spaced apart from each other. Each receiving groove defines a bottom wall and a side wall. Each magnetic film is in one receiving groove and covers the bottom wall and the side wall. The magnetic films are made of magnetic material. Each magnet is in one receiving groove. Each magnetic film is between the substrate and one magnet, a large number of magnetized LEDs of very small size are attracted on a one-to-one basis to the receiving grooves for transfer and placement of the LEDs onto a display panel which is in the course of being manufactured.

Adsorption device and transferring system having same

A method for transferring a large number of light emitting elements in a single operation during display panel manufacture includes providing a receiving substrate with light emitting elements; orienting the light emitting elements on a first platform by a first electromagnetic plate; transferring the light emitting elements on the first platform to a second platform by a second electromagnetic plate; and transferring the light emitting elements on the second platform to the receiving substrate by a third electromagnetic plate. Each light emitting element undergoes a coarse positioning and finer positionings during the transfer process, so an accuracy of the light emitting elements is high.

A method for transferring light emitting elements precisely during manufacture of display panels includes providing light emitting elements; providing a first electromagnetic plate defining magnetic adsorption positions; providing a receiving substrate defining receiving areas; providing a second electromagnetic plate; energizing the first electromagnetic plate to magnetically adsorb one light emitting element at one adsorption position; providing a second electromagnetic plate; and transferring the light emitting elements to one receiving area of the receiving substrate.

A method for transferring light emitting elements precisely during manufacture of display panels includes providing light emitting elements; providing a first electromagnetic plate defining magnetic adsorption positions; providing a receiving substrate defining receiving areas; energizing the first electromagnetic plate to magnetically adsorb one light emitting element at one adsorption position; facing the first electromagnetic plate to the receiving substrate; and transferring the light emitting elements to one receiving area of the receiving substrate.

A method for making a redistribution circuit structure provides a substrate and forms a peelable layer on the substrate. A metal layer is formed on a surface of the peelable layer, the metal layer including a controlling circuit including at least two spaced units. A first photoresist layer is formed on a portion of the surface of the peelable layer and an insulating layer is applied to completely cover the first photoresist layer and the controlling circuit. Through holes are defined in the insulating layer to partially expose the controlling circuit and a seed layer applied on the insulating layer. A block layer is laid to divide the seed layer into multiple sections and electroplating in each section on a portion of the seed layer is applied to form a plating layer with better uniformity of thickness across all sections.

Growing community of inventors

Taipei, Taiwan

Po-Liang Chen