Robert Boschgmbh

California Institute of Technology

Apple Inc.

Compal Electronics, Inc.

Inventec Corp.

Inventec (pudong) Technology Corporation

University of Southern California

Other

Sinotech Engineering Consultants, Inc.

Graham, Andrew

Chen, Po-jui

Yama, Gary

O'brien, Gary

Purkl, Fabian

Feyh, Ando, Lars

Po-Jui Chen

Yu-Chong Tai

Mark Salman Humayun

Damien Craig Rodger

Ando Feyh

Chen-Cheng Wang

Ellis Fan-chuin Meng

Wei Lin

Chun-Chieh Chen

Gary Yama

Che-Hsien Lin

Wei-Hao Lan

Nathan K Gupta

Kuo-Hua Sung

Chia-Chi Lin

Jun Xie

Gary O'Brien

Jason Shih

Fabian Purkl

Cheng-Shiue Jan

Markus Ulm

Sheng-Hung Lee

Yen-Hua Hsiao

Po-Ying Li

John Z Zhong

Victor H Yin

Tyler S Bushnell

Jason C Sauers

Sunggu Kang

Andrew Graham

Axel Franke

Pey-Jiun Ko

Chun-Hao Tung

Soyoung Kim

Dhaval Chandrakant Patel

Mookyung Son

Ando Lars Feyh

Silvio Grespan

Xiaonan Wen

Han-Sheng Siao

Yindar Chuo

Rajat N Agrawal

Yi-Hsuan Chen

Chi-Yuan Shih

Ronalee Lo

Mark S Humayun

Kenrick Kuwahara

Darron K Young

Ching-Yuan Liu

Hui Chen

Robert W Rumford

Steve L Terry

Ellis Meng

Christopher L Boitnott

Steven M Scardato

Matthieu Liger

Ken-Ping Lin

Eugene C Cheung

Xiaofan Niu

Wookyung Bae

Rui Qiao

Xiaoqi Zhou

Cyrus Y Liu

Se Hyun Ahn

Jen-Ting Wei

Martin Eckardt

Rasmi R Das

Wei-Hao Sun

James Edward Alexander Pedder

Jian-Fu Song

Yi Gu

Henry E Herman, Iii

Po-Yi Chou

Hung-Chieh Lo

Chien-Chung Ke

Jui-Ming Yang

Pavan O Gupta

An electronic device with a force sensing device is disclosed. The electronic device comprises a user input surface defining an exterior surface of the electronic device, a first capacitive sensing element, and a second capacitive sensing element capacitively coupled to the first capacitive sensing element. The electronic device also comprises a first spacing layer between the first and second capacitive sensing elements, and a second spacing layer between the first and second capacitive sensing elements. The first and second spacing layers have different compositions. The electronic device also comprises sensing circuitry coupled to the first and second capacitive sensing elements configured to determine an amount of applied force on the user input surface. The first spacing layer is configured to collapse if the applied force is below a force threshold, and the second spacing layer is configured to collapse if the applied force is above the force threshold.

Force sensing architectures

A battery replacement system is configured to move a spare battery to an automatic guided vehicle. The battery replacement system includes a charging stand and a carrier. The charging stand includes a base and a plurality of supporting seat. The supporting seats are pivotably disposed on the base and configured to support the spare battery. The carrier includes a frame and a clamping component. The frame is located aside the charging stand. The clamping component is movably disposed on the frame and configured to replace a vehicle battery on the automatic guided vehicle with the spare battery.

Battery replacement system and automatic guided vehicle

A navigation system adapted for a material storage system, which comprises a monitoring device and a material transporter. The monitoring device generates an order instruction including a first coordinate and a second coordinate, and generates a movement instruction based on the first coordinate and a current coordinate of the material transporter. The material transporter receives the order instruction and the movement instruction, and the material transporter generates and sends the current displacement data to the monitoring device. The material transporter comprises a navigation assembly and a laser pointing element. The navigation assembly detects a first reflected signal and a second reflected signal when the material transporter moves based on the movement instruction and generates the current displacement data. The laser pointing element generates a laser beam based on the second coordinate when the material transporter arrives the first coordinate. This disclosure is further related to a navigation method.

Navigation system for material storage system and navigation method for material transporter

A stand device includes a base, a supporting component and a carrying component. The supporting component is pivotally disposed to the base along a first axis. The carrying component is pivotally disposed to the supporting component along a second axis, and slidably disposed to the supporting component in a first direction. The stand device is switchable between a first state and a second state. In the first state, the extending direction of the supporting component is parallel to the extending direction of the base, and the extending direction of the carrying component is parallel to the extending direction of the supporting component. In the second state, the extending direction of the supporting component is staggered to the extending direction of the base, and the extending direction of the carrying component is staggered to the extending direction of the supporting component.

Stand device

Dual flip stand

An electronic device such as a device with a display may have a force sensor. The force sensor may include capacitive electrodes separated by a deformable layer such as a layer of an elastomeric polymer. The display or other layers in the electronic device may deform inwardly under applied force from a finger of a user or other external object. As the deformed layers contact the deformable layer, the deformable layer is compressed and the spacing between the capacitive electrodes of the force sensor decreases. This causes a measurable rise in the capacitance signal and therefore the force signal output of the force sensor. To prevent the deformable layer from sticking to the inner surface of the display layers, air flow promotion structures may be interposed between the deformable layer and the inner surface of the display. The air flow promotion structures may include spacer pads with anti-stick surfaces.

Electronic device having force sensor air flow promotion structures

Disclosed is an apparatus and method for imaging semi-three-dimensional rock formation along the borehole sidewall, and a database, a calculation module, and a pattern generation module are included and can be configured in an electronic device. The database continuously fetches the acoustic reflection amplitude data from a high resolution acoustic televiewer (HiRAT), which moves vertically along the borehole. The calculation module performs a mathematical and statistical process on the acoustic reflection amplitude data for the pattern generation module to generate the image of semi-three-dimensional structure of rock formation along the borehole sidewall. Thus, the semi-3D rock formation image provided by the present invention is beneficial for the researcher to easily identify the characteristics of rock formation.

Apparatus and method for semi-three-dimensional rock formation imaging along the borehole sidewall

This disclosure provides a pick-and-place device including base, carrying mechanism, driving mechanism and clamping mechanism. Carrying mechanism includes first side part, second side part, two conveyor assemblies and two first driving devices. Conveyor assemblies are respectively disposed on first side part and second side part and configured to carry circuit board. First driving devices are respectively connected to conveyor assemblies so as to respectively turn conveyor assemblies. Driving mechanism is disposed on base. Clamping mechanism includes base plate, clamping assembly and second driving device. Base plate is movably disposed on base via driving mechanism. Clamping assembly includes first claw and second claw are disposed on base plate and configured to pick and place circuit board. Second driving device is disposed on base plate. Second driving device is connected to clamping assembly so as to move first claw and second claw toward or away from each other.

Pick-and-place device

An electronic device and a hinge assembly thereof are provided. The hinge assembly has a first fixing block, a second fixing block, a first linking rod and a second linking rod. The first fixing block has a first end and a second end. The second fixing block has a third end and a fourth end. The first linking rod has a fifth end slidably and rotatably connected to the second end and a sixth end rotatably connected to the fourth end. The second linking rod has a seventh end slidably and rotatably connected to the fourth end and an eighth end rotatably connected to the second end. The sixth end has a groove portion and a first inclined surface, and the eighth end has a second inclined surface contacting the first inclined surface.

Electronic device and hinge assembly thereof

An electronic device and a hinge assembly thereof are provided. The hinge assembly includes a first and a second fixed block, a first and a second polyline rod, a damper rod and a fastener. The first fixed block has a first and a second end, the second fixed block has a third and a fourth end, and the first polyline rod has a fifth and a sixth end, wherein the fifth end is connected to the second end, and the sixth end is connected to the fourth end. The second polyline rod has a seventh connected to the fourth end, and an eighth end, connected to the second end and the sixth end. The damper rod is slidably disposed on the first fixed block, the fastener is fixed to the first fixed block, and a distal end of the damper rod is fastened into the fastener.

Conductive adhesive films can include a binding material having a first set of conductive particles therewithin. The binding material can be electrically non-conductive and can flow between and bond external electronic components during a bonding process. The first set of conductive particles can each have cores formed of a first material, such as polymer, and coatings surrounding the cores, the coatings formed of a second material that is electrically conductive, such as nickel. The binding material can also include a second set of smaller conductive particles formed of a third material that is electrically conductive, such as copper, which can have coatings formed of a fourth material that is electrically conductive, such as silver. The first set of conductive particles can each be sphere shaped, and the second set of conductive particles can each be flake shaped. The conductive particles can form electrical paths between the external electronic components.

Conductive adhesive film structures

An electronic device and a hinge assembly thereof are provided. The hinge assembly includes a first and a second fixed block, a first and a second connecting rod, a damper rod and a fastener. The first fixed block has a first and a second end, the second fixed block has a third and a fourth end, and the first connecting rod has a fifth and a sixth end, wherein the fifth end is connected to the second end, and the sixth end is connected to the fourth end. The second connecting rod has a seventh connected to the fourth end, and an eighth end, connected to the second end and the sixth end. The damper rod is slidably disposed on the first fixed block, the fastener is fixed to the first fixed block, and a distal end of the damper rod is fastened into the fastener.

A sensor module can include a sensor that is configured to detect any given input or environmental conditions, such as, for example, touch or force inputs. The sensor module can be included in an electronic device. Methods for producing the sensor module are disclosed.

Methods for integrating a compliant material with a substrate

Reinforcement components for electrical connections with limited accessibility Shield structures with reduced spacing between adjacent insulation components and systems and methods for making the same are provided. In some embodiments, a reinforcement component may be compressed between two portions of a first electronic component in order to deform the reinforcement component for filling in a void between the reinforcement component and a coupling formed between the first electronic component and a second electronic component. The first electronic component may be a flexible circuit component that may be folded over the reinforcement component prior to the reinforcement component being compressed. This may enable the reinforcement component to be effectively positioned with respect to the first electronic component prior to being deformed for reinforcing one or more couplings made between the first electronic component and the second electronic component.

Reinforcement components for electrical connections with limited accessibility and systems and methods for making the same

Notebook computer

Growing community of inventors

Cupertino, CA, United States of America

Po-Jui Chen