Industrial Technology Research Institute

Po-Hsun Sung

Kai-Hsiang Yen

Jen-Yi Chen

Yu-Jen Fang

Chun-Hsun Chu

Nai-Hao Kuo

Yu-Sheng Hsieh

Wen-Wang Ke

A noise reduction device include at east a cavity; a plurality of ducts noise reduction, at least one of the ducts being connected to the cavity for transmitting an acoustic signal including a noise signal into/out of the cavity; a noise reduction circuit, for receiving the acoustic signal including the noise signal and generating an electrical signal; a microphone for receiving the acoustic signal inside the cavity, converting the received acoustic signal into another electrical signal and transmitting the electrical signal to the noise reduction circuit; and a speaker for receiving the electrical signal generated by the noise reduction circuit, using the received electrical signal to generate an out of phase acoustic signal accordingly, and feeding the out of phase acoustic signal into the cavity to interfere with the noise signal inside the cavity. With the noise reduction circuit and cavity structure designed in the noise reduction device, the full range of noise is attenuated.

Noise reduction device and method thereof

A noise attenuation device comprising a first tube for receiving an acoustic signal, a first housing defining a first cavity between a first surface and a second surface, the first tube being coupled to the first housing at the first surface for conducting the acoustic signal into the first cavity, wherein one end of the first tube contacts the first surface at a first region with a first area, a second housing defining a second cavity between a first surface and a second surface, and a second tube coupled between the second surface of the first housing and the first surface of the second housing for conducting the acoustic signal between the first cavity and the second cavity, wherein one end of the second tube contacts the second surface of the first housing at a second region with a second area, wherein the first tube, the first housing and the second tube form a filter structure and the area of the first surface of the first housing is greater than the first area and the area of the second surface of the first housing is greater than the second area.

Acoustic transducer device

A micro acoustic transducer and manufacturing method are provided. Firstly, a substrate having one first and second cavities is provided. Then, a backplate with a plurality of acoustic holes is formed on the substrate, and a diaphragm is formed on the backplate. An air gap is formed between the backplate and the diaphragm. The air gap, second cavity, and first cavity are communicated with each other through the acoustic holes. A plurality of rings is formed around the diaphragm. These rings are used to hitch pillars formed on the substrate or fasteners can be formed on the substrate for fastening the diaphragm on fastener holes. Through the arrangement of the rings or fasteners used as the boundary structure of the diaphragm, the mechanical sensitivity of the diaphragm is improved. Moreover, the backplate is supported by a single crystal structure formed by etching the substrate such that the stability is promoted.

Micro acoustic transducer and manufacturing method therefor

An electro-acoustic sensing device including a sensing chip, a carrier chip and a sealing element is provided. The sensing chip is for electro-acoustic transuding and thereby outputting an electrical signal. The carrier chip disposed below the sensing chip has at least one second connecting point, at least one electrical channel and at least one channel connecting point. The second connecting point is electrically contacted with the first connecting point. The second connecting point and the channel connecting point are located at different surfaces of the carrier chip. The electrical channel passes through the carrier chip and electrically connects the second connecting point and the channel connecting point. The electrical signal is transmitted to the channel connecting point via the first and the second connecting points and the electrical channel. The sealing element is disposed between the sensing chip and the carrier chip for air-tight coupling the two chips.

Electro-acoustic sensing device

A sensor including a carrier, a plurality of conductive bumps, a capacitive sensing element connected to the carrier through the conductive bumps, and a cover is provided. The capacitive sensing element has a membrane, and a channel is formed among the capacitive sensing element, the conductive bumps, and the carrier. The cover is disposed on the carrier for covering the capacitive sensing element. A chamber is formed between the capacitive sensing element and the cover. The chamber and the channel are respectively located at two sides of the membrane.

Sensor

A sensor including a carrier having two channels, a capacitive sensing element disposed on the carrier, and a cover is provided. The capacitive sensing element has a membrane, and a first chamber is formed between the membrane and the carrier. The cover is disposed on the carrier for covering the capacitive sensing element. A second chamber is formed between the membrane and the cover. The first chamber and the second chamber are located at two sides of the membrane, and the channels are respectively communicated with the first chamber and the second chamber.

An acoustic wave sensing device integrated with micro-channels and a method for the same are described. The present invention uses a piezoelectric substrate with a thinner portion serving as a sensing area and formed via a micromaching or chemical process. An inter-digital transducer (IDT) is located on the thinner portion to produce flexural plate waves (FPW). The micro-channels can be formed together with the thinner portion via the same manufacturing process, or integrated into the piezoelectric substrate via linkage. In the present invention, a novel manufacturing process and design are proposed for fabrication of the acoustic wave sensing devices with a good piezoelectric characteristic, a stable temperature compensation property, and a robust structure. Thereby, the techniques of flexural plate waves can be applied for liquid sensors. In this way, the drawbacks of the conventional acoustic wave sensing devices, such as poor piezoelectric properties and fragile film structures, are removed.

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Kaohsiung, Taiwan

Po-Hsun Sung