Foxconn Technology Co., Ltd.

Po-Hsuan Kuo

Ching-Bai Hwang

Chih-Hsun Lin

A cooling fan includes a housing, a cover on the housing and an impeller received in a space between the housing and the cover. The housing includes a bottom wall and a sidewall projecting upwardly from an outer periphery of the bottom wall. The sidewall defines an air outlet therein. The impeller includes a hub and a plurality of blades extending radially out from the hub. A porous layer extends into the space between the housing and the cover from the sidewall at a location adjacent to the air outlet.

Cooling fan

A cooling fan includes a housing, a cover arranged on the housing, and an impeller received in a space formed between the housing and the cover. The impeller includes a hub and a plurality of blades extending radially and outwardly from the hub. Each of the blades includes a windward surface and a leeward surface opposite to the windward surface. A porous layer is disposed on the leeward surface of each of the blades, adjacent to a free end thereof. The porous layer has one side surface attached to the leeward surface and an opposite side surface facing the windward surface of an adjacent blade.

Impeller and cooling fan incorporating the same

A thermal module includes a fin assembly, a heat spreader, a heat pipe connected between the fin assembly and the heat spreader, and a securing plate. The securing plate has at least three resilient members secured on a bottom surface thereof. Each of the resilient members has a capability to deform resiliently along a direction perpendicular to the bottom surface of the securing plate to resiliently press the heat spreader to an electronic component.

Growing community of inventors

Taipei Hsien, Taiwan

Po-Hsuan Kuo