Asclepiumm Taiwan Co., Ltd

Mediatek Corporation

Po-hao Chang

Min-che Chen

Ya-chuan Liu

Yi-Jou Lin

Chun-wei Chen

Hung-Chuan Chen

Ya-ping Tsai

Pei-yi Lee

A semiconductor package structure includes a first semiconductor die and a second semiconductor die neighboring the first semiconductor die. The first semiconductor die includes a first edge, a second edge opposite the first edge, and a first metal layer exposed from the second edge. The second semiconductor includes a third edge neighboring the second edge of the first semiconductor die, a fourth edge opposite the third edge, and a second metal layer exposed from the third edge. The first metal layer of the first semiconductor die is electrically connected to the second metal layer of the second semiconductor die.

Semiconductor package structure and method for forming the same

The invention relates to antibody fusion proteins. Particularly, the invention relates to antibody fusion proteins for intra-cellular and intra-nucleus drugs delivery. The fusion protein of the invention can be used as a peptide penetration system that specifically binds to various targets for the delivery of effector peptides across a biological barrier.

Desmoglein 2 antibody fusion proteins for drug delivery

The invention provides antibodies against the antigen containing the Dsg2 extracellular domain 2. Also provided is the method of using the antibodies in treatment or prevention of a cancer.

Dsg2 monoclonal antibody and the applications thereof

Growing community of inventors

Taipei, Taiwan

Po-hao Chang