Altus Technology Inc.

Po-Chih Hsu

Ying-Cheng Wu

Steven Webster

Kun-Hsieh Liu

A digital camera module () includes a lens holder (), a lens module () received in the lens holder, and an image sensor chip package () mounted to the lens holder. The lens module includes a lens barrel () movably engaged in the lens holder and at least one lens () received in the lens barrel. The image sensor chip package includes a base (), an image sensor chip () mounted on the base, a transparent cover (), and an adhesive () positioning the transparent cover with respect to the image sensor chip. The adhesive and the transparent cover cooperatively seal the image sensor chip therein.

Digital camera module with small sized image sensor chip package

A digital still camera module includes an image sensor package () and a lens barrel () mounted on the image sensor package. The image sensor package includes a substrate (), an image sensor chip (), and a cover (). The substrate defines a receiving chamber () therein. The image sensor chip mounted in the receiving chamber of the substrate. The cover, which is transparent and has a smaller profile than that of the substrate, is secured to the top portion of the substrate thereby sealing the receiving chamber. The top portion of the substrate has an uncovered section () at a periphery of the cover. The lens barrel includes at least one lens () received therein. The lens barrel is securely attached to the uncovered section of the top portion of the substrate.

Digital still camera module

An IC (integrated circuit) chip package includes a substrate (), a chip (), a plurality of bonding wires (), and a cover (). The substrate has a top surface, a bottom surface, a receiving chamber () defined therein, a plurality of solder pads () arranged around the top surface and the bottom surface, and a plurality of vias () having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate to cover the opening, and has a smaller profile than that of the substrate, thereby not cover a peripheral area of the top surface.

IC chip package with cover

An IC chip package includes a substrate (), a chip (), a plurality of bonding wires (), and a cover (). The substrate has a top surface, a receiving chamber () having an opening at the top surface, a plurality of solder pads () arranged around the top surface and respectively corresponding to the solder pads arranged at a bottom surface opposite to the top surface, and a plurality of vias () having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads () arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate, and covers the opening.

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Miao-Li, Taiwan

Po-Chih Hsu