Sonion Mems A/s

Epcos Pte Ltd

Microtronic A/s

Danfoss A/s

Sonion Nederland B.v.

Pulse Mems Aps.

Pirmin Rombach

Matthias Mullenborn

Matthias Müllenborn

Siebe Bouwstra

Ole Hansen

Matthias Heschel

Maja Amskov Gravad

Aart Zeger Van Halteren

Martin Bondo Jørgensen

Peter Ulrik Scheel

Christoffer Graae Greisen

Lars J Stenberg

Henrik Laurids Hvims

Jorgen B Elmer, Legal Representative

Jørgen B Elmer, Legal Representative

Henrick Laurids Hvims

Matthias M&uuml;llenborn

Jörg Rehder

Karen Birkelund

Morten Ginnerup

Morten Berg Arnoldus

The invention relates to an acoustic micro-electrical-mechanical-system (MEMS) transducer formed on a single die based on a semiconductor material and having front and back surface parts opposed to each other. The invention further relates to a method of manufacturing such an acoustic MEMS transducer. The acoustic MEMS transducer comprises a cavity formed in the die to thereby provide a back volume with an upper portion facing an opening of the cavity and a lower portion facing a bottom of the cavity. A back plate and a diaphragm are arranged substantially parallel with an air gap there between and extending at least partly across the opening of the cavity, with the back plate and diaphragm being integrally formed with the front surface part of the die. The bottom of the cavity is bounded by the die. The diaphragm may be arranged above the back plate and at least partly extending across the back plate. It is preferred that the backside openings are formed in the die with the openings extending from the back surface part of the die to the cavity bottom. Part of or all of the backside openings may be acoustically sealed by a sealing material.

Single die MEMS acoustic transducer and manufacturing method

A solid state silicon-based condenser microphone comprising a silicon transducer chip (). The transducer chip includes a backplate () and a diaphragm () arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm () is movable relative to the backplate () in response to incident sound. An integrated electronic circuit chip () or ASIC is electrically coupled to the transducer chip (). An intermediate layer () fixes the transducer chip () to the integrated electronic circuit chip () with the transducer chip () on a first side of the intermediate layer () and the integrated electronic circuit chip () on a second side of the intermediate layer () opposite the first side. The intermediate layer () has a sound inlet () on the same side as the ASIC giving access of sound to the diaphragm.

Solid state silicon-based condenser microphone

A microphone assembly comprising a housing in which a transducer element is positioned. In the housing, an upper and a lower chamber are defined, the lower chamber extending at least at one edge of the transducer element and potentially to an upper side thereof. An element, such as a horse-shoe shaped element or a circular element, is provided for separating the upper side of the transducer element into the upper and lower chambers. The transducer element is fixed using flexible fixing means, and space is provided at one or more sides of the transducer element to take up thermal expansion and retraction of the housing and the transducer element.

Microphone assembly

This invention relates to absolute pressure sensors with two bonded wafers containing a pressure sensing structure and forming a reference pressure chamber and a buffer chamber. Since the buffer chamber collects molecules, which permeate through a bonding interface between the two wafers, a raise in pressure of the reference chamber can be avoided. The sensor is therefore more resistant to pressure equalisation between the pressure chamber and the pressure of the surroundings, i.e. the sensed pressure and repetitive recalibration of the sensor can be avoided.

Silicon pressure sensor with decreased pressure equalization between measured pressure and reference chamber

The present invention relates to an miniature actuator especially suitable for hearing aid applications. The actuator according to the present invention operates according to the change in reluctance principle. In particular, the actuator according to the present invention operates in a balanced configuration comprising two planar coils, two magnets, a membrane and a spacer chip providing the necessary back chamber volume.

Micromachined magnetically balanced membrane actuator

The present invention relates to compact solid state silicon-based condenser microphone systems suitable for batch production. The combination of the different elements forming the microphone system is easier and more economical to manufacture compared to any other system disclosed in prior art. In addition the invention is compatible with electronic equipment manufacturing processes, such as SMD pick and place techniques. The invention uses a transducer chip comprising a chamber, a diaphragm that is positioned at the first lower surface and covering the second opening of the transducer chip. The transducer chip is flip-chip mounted onto a post-processed chip also comprising a chamber. The microphone system can be electrically connected to an external substrate by conventional techniques such as wire bonding.

Pressure transducer

A method of manufacturing a transducer of the type having a diaphragm ( ) with a predetermined tension. After the transducer has been manufactured with its basic structure the diaphragm is adjusted to have a predetermined tension, which is preferably low in order to obtain a high sensitivity. Two embodiments are disclosed. One embodiment includes heating the transducer to a temperature above the glass transition temperature of the material ( ) retaining the diaphragm. Another embodiment includes measuring the actual tension of the diaphragm, which can be used to calculate an adjustment of the thickness of the diaphragm resulting in the desired tension.

Method of manufacturing a transducer having a diaphragm with a predetermined tension

A solid state silicon-based condenser microphone comprising a silicon transducer chip (1). The transducer chip includes a backplate (13) and a diaphragm (12) arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm (12) is movable relative to the backplate (13) in response to incident sound. An integrated electronic circuit chip (3) or ASIC is electrically coupled to the transducer chip (1). An intermediate layer (2) fixes the transducer chip (1) to the integrated electronic circuit chip (3) with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side. The intermediate layer (2) has a sound inlet (4) on the same side as the ASIC giving access of sound to the diaphragm.

A microelectric position sensor wherein an assembly of magnetic field sensitive elements assume first and second states when subjected to a magnetic field having an intensity below or above first or second predetermined values respectively. A magnet is selectively movable relative to the assembly, so that the elements are selectively subjected to the magnetic field. The magnet has focusing tongues for focusing the magnetic field at a region including substantially only one of the elements, so that the magnetic field within the region has an intensity above the second value, and the magnetic field outside the region has an intensity below the first value.

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Lyngby, Denmark

Pirmin Rombach