Macdermid Enthone Gmbh

Enthone Incorporated

Pingping Ye

Thomas B Richardson

Kyle M Whitten

Elie H Najjar

Jianwen Han

Stephan I Braye

Joseph Anthony Abys

Edward J Kudrak

Cai Wang

Yung-Herng Yau

Karl F Wengenroth

Xingping Wang

Robert Farrell

A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.

Compositions and methods for the electrodeposition of nanotwinned copper

A method is provided for depositing a whisker resistant tin-based coating layer on a surface of a copper substrate. The method is useful for preparing an article comprising a copper substrate having a surface; and a tin-based coating layer on the surface of the substrate, wherein the tin-based coating layer has a thickness between 0.5 micrometers and 1.5 micrometers and has a resistance to formation of copper-tin intermetallics, wherein said resistance to formation of copper-tin intermetallics is characterized in that, upon exposure of the article to at least seven heating and cooling cycles in which each cycle comprises subjecting the article to a temperature of at least 217&#xb0; C. followed by cooling to a temperature between about 20&#xb0; C. and about 28&#xb0; C., there remains a region of the tin coating layer that is free of copper that is at least 0.25 micrometers thick.

Immersion tin silver plating in electronics manufacture

Growing community of inventors

Bethany, CT, United States of America

Pingping Ye