Asm Technology Singapore Pte Ltd

Pingliang Tu

Jun Qi

Kui Kam Lam

Chao Liu

Chun Hung Samuel Ip

Yong Wang

Ka Fai Fung

Pak Lun Cheng

Zhao Yang

A semiconductor die is bonded using epoxy onto a substrate supported on a heating platform. After preheating the substrate with the heating platform to a temperature of between 25&#xb0; C. and 60&#xb0; C., an epoxy dispenser deposits an epoxy dot onto the substrate before the semiconductor die is placed onto the epoxy dot with a pick head to thereby bond the semiconductor die onto the substrate.

Heating of a substrate for epoxy deposition

A die attachment apparatus for attaching a semiconductor die onto a substrate having a metallic surface comprises a material dispensing station for dispensing a bonding material onto the substrate and a die attachment station for placing the semiconductor die onto the bonding material which has been dispensed onto the substrate. An activating gas generator positioned before the die attachment station introduces activated forming gas onto the substrate in order to reduce oxides on the substrate.

Die attachment apparatus and method utilizing activated forming gas

Growing community of inventors

Hong Kong, China

Pingliang Tu