Xerox Corporation

Hewlett-Packard Development Company, L.p.

Palo Alto Research Center Inc.

Applied Materials, Inc.

Ping Mei

James B Boyce

Robert Anthony Street

Carl Philip Taussig

Steven E Ready

Warren Bruce Jackson

Janos Veres

Brent Shawhan Krusor

Tse Nga Ng

Gregory Lewis Whiting

Albert Hua Jeans

Rene A Lujan

David Kirtland Fork

Jeng Ping Lu

Hao Luo

Craig M Perlov

David Eric Schwartz

Francesco Lemmi

Michael G Hack

Christopher L Chua

David P Bour

Raj B Apte

Andrew J Moore

David Kalman Biegelsen

Linda T Romano

Kent J Evans

Michael A Kneissl

Richard E Elder

Richard I Johnson

Sivkheng Kor

Biby Esther Abraham

Gregory B Anderson

Koenraad F Van Schuylenbergh

James Robert Eaton

Jonathan Rivnay

Han-Jun Kim

Norbert H Nickel

Edward Robert Holland

Nan-Xing Hu

Yiliang Wu

Jennifer Lynne Belelie

Lihua Zhao

Jurgen Hans Daniel

Yu Wang

Guiqin Song

Jengping Lu

Decai Sun

Jaan Noolandi

John Steven Paschkewitz

James A Brug

Patricia A Beck

Christian G Van De Walle

Jackson H Ho

Sean Emerson Doris

Corie Lynn Cobb

Harry Jonathan McIntyre

Yunda Wang

Angeles Marcia Almanza-Workman

Yujie Zhu

JengPing Lu

Yong Zhang

Kathleen Dore Boyce, Legal Representative

Marcia Almanza-Workman

Robert A Garcia

Carl Philp Taussig

Carl Phillip Taussig

Rachel Lau

Greg B Anderson

Steve Ready

Harry J Mcintyre

A thin form of an electrical connector for creating a detachable connection between two circuit elements is disclosed. When the connector is employed, only an outer electrode present on a portion of the connector is exposed to the ambient environment and the rest of the electronics of both the connector and of a device into which the device is integrated can be insulated from the ambient environment. The parts of the connector can create a small three-dimensional interlock structure to seal off contact area and to facilitate electrical contacts between two circuit elements. The connector structure is flexible, allowing the connector to be embedded into a curved surface of a device that can use the electrode exposed to the environment to obtain data regarding the environment.

Multi-part sensing electrode connector

Systems and methods are provided for monitoring object placement on a surface. The system includes a pressure-sensitive conductive sheet. The pressure-sensitive conductive sheet includes a stretchable fabric, having a plurality of fibers, and a conductive material positioned on a plurality of adjoining fibers of the stretchable fabric. The system further includes a 3-dimensional structure positioned under the pressure-sensitive conductive sheet. The 3-dimensional structure includes one or more depressions onto which the stretchable fabric can be stretched and the conductive material is positioned over the one or more depressions.

Systems and methods for improved object placement sensing for point-of-purchase sales

A system includes a structure configured to hold items, at least one capacitive touch sensor, and an item scanner configured to move the capacitive touch sensor relative to the structure and to identification elements disposed on the items held by the structure. Each identification element represents a multi-digit code. The capacitive touch sensor is configured to generate a sensor signal comprising sequences of waveforms in response to movement of the capacitive touch sensor relative to the identification elements. Each sequence of waveforms includes the multi-digit code that identifies one of the items.

Object identification

A print feedstock has a base material and a marker material, the base material and the marker material having different physical properties. A system to validate objects includes at least one printer to print feedstock onto an object, the feedstock comprising a base material and a marker material, the base material and a marker material having different properties, a device to create a unique identifier for the object based upon a pattern of the feedstock, and a store in which the unique identifier can be stored.

Printable unclonable function patterns

A system and method of printing on a strand element with a printer head. The printer head includes a conduit and a cavity formed within the conduit, wherein the cavity is configured to receive the strand element and pass the strand element from a first end of the cavity to a second end of the cavity. The printer head also includes a set of nozzles formed on the conduit and positioned on a perimeter of the cavity around a first target location within the cavity, wherein at least one of the nozzles is a fluid nozzle configured to dispense a fluid, and at least one of the nozzles is a vacuum nozzle configured to apply a vacuum force on the cavity.

Printer head for strand element printing

Systems and methods for operating a tag system. The methods comprising: emitting a wireless signal from an antenna of the tag with a first signal characteristic when the tag is proximate to an active antenna modulation marker; changing an impedance of a sensor from a first impedance value to a second impedance value when the active antenna modulation marker is exposed to a stimulus; and emitting a wireless signal from the antenna of the tag with a second signal characteristic when the tag is proximate to the active antenna modulation marker and the sensor has the second impedance value.

Tag system with a modulator of an antenna modulator and methods of use

Systems and methods for bonding an electronic component to substrate with a rough surface. The method comprising: disposing an insulating adhesive on the substrate; applying heat and pressure to the insulating adhesive to cause the adhesive to flow into at least one opening formed in the substrate; curing the insulating adhesive to form a pad that is at least partially embedded in the substrate and comprises a planar smooth surface that is exposed; disposing at least one trace on the planar smooth surface of the pad; depositing an anisotropic conductive material on the pad so as to at least cover the at least one trace; placing the electronic component on the pad so that an electrical coupling is formed between the electronic component and the at least one trace; and bonding the electronic component to the substrate by curing the anisotropic conductive material.

Systems and methods for bonding electronic components on substrates with rough surfaces

A system and method of printing on a strand element with a printer head. The printer head includes a conduit and a cavity formed within the conduit, wherein the cavity is configured to receive the strand element and pass the strand element from a first end of the cavity to a second end of the cavity. The printer head also includes a first set of fluid nozzles formed on the conduit and positioned on a perimeter of the cavity around a first target location within the cavity, wherein each of the fluid nozzles in the first set is positioned to aim at the first target location, and the first target location corresponds to a location of a first segment of the strand element when the strand element is positioned within the cavity.

Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among other configurations, to form electronic assemblies. The surface of the electronic circuit component carries electronic elements such as conductive traces and/or other configurations including contact pads. A method for forming an electronic assembly includes providing a tacky layer. Then an electronic circuit component is provided having a first side and a second side, where the first side carries the electronic elements. The first side of the electronic circuit component is positioned into contact with the tacky layer. A bonding material is then deposited to a portion of the adhesive layer that is not covered by the first side of the electronic circuit component, to a depth which is sufficient to cover at least a portion of the electronic circuit component. The bonding material is then fixed or cured into a fixed or cured bonding material, and the tacky layer is removed. By these operations, the electronic circuit component is held in a secure attachment by the fixed or cured bonding material, and circuit connections may be made.

Bare die integration with printed components on flexible substrate without laser cut

An input device includes one or more groups of two or more touch sensitive elements. Each group of two or more touch sensitive elements is arranged to generate a sequence of electronic waveforms corresponding to a multi-digit code that identifies the group in response to a swiping touch across the two or more touch sensitive elements.

Interface including passive touch sensitive input device

Systems and methods for operating a tag system. The methods comprising: wirelessly communicating, from a tag, a first signal at a first frequency spectrum that allows a tag reader to detect the first signal, when the tag is not proximate to an antenna modulation marker or when the antenna modulation marker has a first orientation relative to the tag; and performing operations by the tag to wirelessly communicate a second signal at a second frequency spectrum that does not allow the tag reader to detect the first signal, when the tag is proximate to the antenna modulation marker or when the antenna modulation marker has a second different orientation relative to the tag.

Tag system implementing a normal-on antenna and methods of use

Development of smart objects with electronic functions requires integration of printed components with IC chips or dies. Conventional chip or die bonding including wire bonding, flip chip bonding, and soldering may not be applicable to chip or die attachment on low temperature plastic surfaces used in physical objects. Printing conductive connection traces requires a smooth interface between contact pads of a chip and the surface of the physical object. In order to address this issue of chip/die attachment to a physical object, this disclosure provides embodiments to construct a fixture on a chip or die for attachment and electrical connection onto a physical object by printing operations and/or ACF bonding methods.

Method and fixture for chip attachment to physical objects

A method and system utilizes ink jetting or printing of surface work function modification material or solution to form modified p-type and/or n-type electrodes. The proposed method is suitable for making complementary OTFT circuits in roll-to-roll fabrication environment.

Selective surface modification of OTFT source/drain electrode by ink jetting F4TCNQ

Systems and methods for operating a tag system. The methods comprise performing the following operations by a tag having an antenna: emitting a signal at a first frequency spectrum, if the tag is not proximate to a tag modulation marker; and emitting a signal at a second frequency spectrum, if the tag is proximate to the tag modulation marker.

Tag system and methods of use

A method of fabricating a color filter array including providing substrate, forming a multilevel structure that is attached to the substrate, etching the multilevel structure to expose first wells in the multilevel structure, filling at least the first wells in the multilevel structure with the first color component, curing the first color component, etching the multilevel structure to expose second wells in the multilevel structure, filling at least the second wells in the multilevel structure with a second color component, and curing the second color component.

Method of fabricating a color filter array using a multilevel structure

Growing community of inventors

San Jose, CA, United States of America

Ping Mei