National Chung Shan Institute of Science and Technology

Chung Shan Institute of Science and Technology

Chung-shan Institute of Science and Technology, Armaments Bureau, M.n.d

Ping-Kuo Weng

Shiang-Feng Tang

Yau-Tang Gau

Wen-Jen Lin

Hsien-Ming Wu

Jiunn-Jye Luo

San-Te Yang

Ker-Jer Huang

Der-Ren Kang

Chen-Der Chiang

Wei-Wu Kuo

Yin-Yi Wu

Chih-Chang Shih

A microbolometer read-out circuit includes an extraction circuit configured to detect a voltage signal of a temperature variation; an analog-to-digital converter coupled to the extraction circuit and configured to digitalize the voltage signal of the temperature variation; an image processing circuit coupled to the analog-to-digital converter; and wherein the image processing circuit is coupled to a gain digital-to-analog converter and an offset digital-to-analog converter.

Microbolometer readout circuit and calibration method using the same

The present invention relates to a verification architecture of an infrared thermal imaging array module, which includes the following steps. Perform specification design of thermal imaging module, epitaxy, and verification of optical characteristics for calibrating epitaxial parameters. Perform a fabrication process of single-device-type sensing device and verification of changing-temperature optoelectronic measurement by measuring and calibrating at low temperatures by changing temperatures and voltages. Perform a fabrication process of focal-plane array and verification of optoelectronic uniformity and test for dark-current uniformity. Perform a fabrication process and verification of jointing and thinning the focal-plane array and the ROIC. The focal-plane sensing module and the ROIC are jointed by indium bonding, and optoelectronic signal conversion is performed using the sensing array module. Perform the verification of integrated test on thermal image quality. Optimum driving and controlling output parameters are tuned for performing analysis and test on thermal image quality of the module. Manufacture the prototype of the thermal imaging array module, which is jointed with the focal-plane sensing array by indium bonding. Thereby, the prototype of the thermal imaging array module is completed.

Verification architecture of infrared thermal imaging array module

A disposable two-step endoscope for examining human organs includes an image capturing and transmission device and a cable that may be disconnected. The image capturing and transmission device includes a body, luminous devices, an optical image capturing device, a wireless transmission device and an internal power supply. The cable transmits the electric power outside and signals. The luminous device projects light on the human organs. The optical image capturing device captures organ images. The wireless transmission device transmits the organ images outside the human body. The internal power supply provides electric power for signal transmission after the cable and the image capturing and transmission device are separated.

Disposable two-step endoscope

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Longtan, Taiwan

Ping-Kuo Weng