Advanced Technology Materials, Inc.

Entegris, Inc.

Ping Jiang

Michael B Korzenski

Tianniu Chen

Mackenzie E King

Pamela M Visintin

Svitlana Grigorenko

André Brosseau

Thomas H Baum

John Charles Warner

Steven M Bilodeau

David Daniel Bernhard

Karl E Boggs

James Glenn Norman

Melissa K Rath

Kim Van Berkel

George Mirth

Renjie Zhou

Laura Ingalls

Dinakar Gnanamgari

Fred Strickler

Ted Mendum

Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be collected for reuse and recycling.

Method for recycling of obsolete printed circuit boards

Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.

Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment

Processes for recycling electronic components removed from printed wire boards, whereby precious metals and base metals are extracted from the electronic components using environmentally friendly compositions. At least gold, silver and copper ions can be extracted from the electronic components and reduced to their respective metals using the processes and compositions described herein.

Sustainable process for reclaiming precious metals and base metals from e-waste

Compositions and methods of using said composition for removing polymeric materials from surfaces, preferably cleaning contaminant buildup from a lithography apparatus without total disassembly of said apparatus.

Lithographic tool in situ clean formulations

A removal composition and process for removing low-k dielectric material, etch stop material, and/or metal stack material from a rejected microelectronic device structure having same thereon. The removal composition includes hydrofluoric acid. The composition achieves at least partial removal of the material(s) from the surface of the microelectronic device structure having same thereon, for recycling and/or reuse of said structure, without damage to the underlying polysilicon or bare silicon layer employed in the semiconductor architecture.

Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon

A liquid removal composition and process for removing photoresist and/or sacrificial anti-reflective coating (SARC) material from a microelectronic device having same thereon. The liquid removal composition includes at least one organic quaternary base and at least one surface interaction enhancing additive. The composition achieves at least partial removal of photoresist and/or SARC material in the manufacture of integrated circuitry with minimal etching of metal species on the microelectronic device, such as copper and cobalt, and without damage to low-k dielectric materials employed in the microelectronic device architecture.

Metals compatible post-etch photoresist remover and/or sacrificial antireflective coating etchant

Growing community of inventors

Danbury, CT, United States of America

Ping Jiang